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1. (WO2007001505) DIE MODULE SYSTEM AND METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001505 International Application No.: PCT/US2006/006935
Publication Date: 04.01.2007 International Filing Date: 27.02.2006
IPC:
H05K 1/11 (2006.01) ,H01K 1/14 (2006.01)
H ELECTRICITY
05
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K
PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1
Printed circuits
02
Details
11
Printed elements for providing electric connections to or between printed circuits
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
K
ELECTRIC INCANDESCENT LAMPS
1
Details
02
Incandescent bodies
14
characterised by the shape
Applicants:
STAKTEK GROUP L.P. [US/US]; Suite 125 8900 Shoal Creek Blvd. Austin, TX 78757, US (AllExceptUS)
CADY, James, W. [US/US]; US (UsOnly)
GOODWIN, Paul [US/US]; US (UsOnly)
Inventors:
CADY, James, W.; US
GOODWIN, Paul; US
Agent:
DENKO, J., Scott; Fish & Richardson P.C. P.O. Box 1022 Minneapolis, MN 55440-1022, US
Priority Data:
11/157,56521.06.2005US
Title (EN) DIE MODULE SYSTEM AND METHOD
(FR) SYSTÈME ET PROCÉDÉ DE MODULE À PUCES
Abstract:
(EN) A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.
(FR) Selon la présente invention, un circuit souple est équipé sur un ou les deux côtés d’une multitude de puces. Dans un mode de réalisation préféré, le circuit souple est équipé d’une puce retournée. Un côté du circuit souple possède un dispositif de connexion mis en application dans un mode de réalisation préféré avec les fiches d’un connecteur plat. Le circuit souple est disposé autour d’un substrat de façon à former un module de circuit qui peut être inséré dans un connecteur plat tel que ceux que l’on trouve typiquement sur une carte d’ordinateur.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)