Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2007001313) A METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESSES
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001313 International Application No.: PCT/US2005/023950
Publication Date: 04.01.2007 International Filing Date: 30.06.2005
Chapter 2 Demand Filed: 08.11.2006
IPC:
H01L 21/3065 (2006.01) ,H01J 37/32 (2006.01) ,G05D 16/20 (2006.01)
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
L
SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21
Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02
Manufacture or treatment of semiconductor devices or of parts thereof
04
the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18
the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30
Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302
to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
306
Chemical or electrical treatment, e.g. electrolytic etching
3065
Plasma etching; Reactive-ion etching
H ELECTRICITY
01
BASIC ELECTRIC ELEMENTS
J
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37
Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32
Gas-filled discharge tubes
G PHYSICS
05
CONTROLLING; REGULATING
D
SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
16
Control of fluid pressure
20
characterised by the use of electric means
Applicants:
UNAXIS USA INC. [US/US]; 10050 16th Street North St. Petersburg, FL 33718, US (AllExceptUS)
Inventors:
WESTERMAN, Russell; US
TEIXEIRA, Mike; US
JOHNSON, David; US
LAI, Shouliang; US
Agent:
KAUGET, Harvey, S. ; Holland & Knight LLP 100 N. Tampa Street Suite 4100 Tampa, FL 33602-3644, US
Priority Data:
11/155,90420.06.2005US
Title (EN) A METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESSES
(FR) METHODE ET APPAREIL POUR LE CONTROLE DE PROCEDE DANS DES PROCEDES DE GRAVURE PAR MULTIPLEXAGE TEMPOREL
Abstract:
(EN) The present invention provides a method for controlling pressure in a chamber during a time division multiplexed process. A throttle valve is positioned based on an open-loop pressure control algorithm within at least one step of the time division multiplexed etch process. A pressure response of the step is evaluated and compared to a desired pressure response. The throttle valve is then positioned through a proportional, integral and derivative controller step to step of the time division multiplexed etch process based on the evaluation to the desired pressure response.
(FR) La présente invention a trait à une méthode pour le contrôle de pression dans une enceinte lors d'un procédé de multiplexage temporel. Une vanne d'étranglement est positionnée en fonction d'un algorithme de contrôle de pression en boucle ouverte dans au moins une étape de procédé de gravure par multiplexage temporel. Une réaction de pression de l'étape est évaluée et comparée à une réaction de pression souhaitée. La vanne d'étranglement est ensuite positionnée via un contrôleur proportionnel intégral et dérivé échelonné du procédé de gravure par multiplexage temporel en fonction de l'évaluation à la réaction de pression souhaitée.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP1897127JP2008544546CN101228618