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1. (WO2007001301) ATOMIC LAYER DEPOSITION (ALD) SYSTEM AND METHOD
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001301 International Application No.: PCT/US2005/022896
Publication Date: 04.01.2007 International Filing Date: 27.06.2005
IPC:
C23C 16/455 (2006.01)
C CHEMISTRY; METALLURGY
23
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
C
COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
16
Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition (CVD) processes
44
characterised by the method of coating
455
characterised by the method used for introducing gases into the reaction chamber or for modifying gas flows in the reaction chamber
Applicants:
CAMBRIDGE NANOTECH INC. [US/US]; 23 Perry Street Cambridge, MA 02139, US (AllExceptUS)
MONSMA, Douwe, J. [NL/US]; US (UsOnly)
BECKER, Jill, S. [DE/US]; US (UsOnly)
Inventors:
MONSMA, Douwe, J.; US
BECKER, Jill, S.; US
Agent:
WALAT, Robert, H.; Wolf, Greenfield & Sacks, P.C. 600 Atlantic Avenue Boston, MA 02210, US
Priority Data:
60/583,85428.06.2004US
60/652,54114.02.2005US
Title (EN) ATOMIC LAYER DEPOSITION (ALD) SYSTEM AND METHOD
(FR) PROCEDES ET SYSTEMES DE DEPOT PAR EVAPORATION SOUS VIDE
Abstract:
(EN) Vapor deposition systems and methods associated with the same are provided. The systems may be designed to include features that can promote high quality deposition; simplify manufacture, modification and use; as well as, reduce the footprint of the system, amongst other advantages.
(FR) L'invention concerne des systèmes de dépôt par évaporation sous vide et des procédés associés à ces systèmes. Ces systèmes peuvent être conçus de manière à inclure des fonctionnalités permettant d'améliorer la qualité du dépôt ; de faciliter la fabrication, les modifications et l'utilisation ; ainsi que de réduire l'encombrement du système, entre autres avantages.
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
KR1020070048177EP2161352EP1771598CN101040060