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1. (WO2007001078) SURFACE PROTECTION SHEET FOR LASER MATERIAL PROCESSING
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001078 International Application No.: PCT/JP2006/313192
Publication Date: 04.01.2007 International Filing Date: 27.06.2006
IPC:
B23K 26/18 (2006.01) ,B23K 26/38 (2006.01) ,B23K 103/04 (2006.01) ,B23K 103/10 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
18
using absorbing layers on the material being worked, e.g. for marking or protecting purposes
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26
Working by laser beam, e.g. welding, cutting, boring
36
Removing material
38
by boring or cutting
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
02
Iron or ferrous alloys
04
Steel alloys
B PERFORMING OPERATIONS; TRANSPORTING
23
MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
K
SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
103
Materials to be soldered, welded or cut
08
Non-ferrous metals or alloys
10
Aluminium or alloys thereof
Applicants:
日東電工株式会社 NITTO DENKO CORPORATION [JP/JP]; 〒5678680 大阪府茨木市下穂積1丁目1番2号 Osaka 1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka 5678680, JP (AllExceptUS)
花木 一康 HANAKI, Ikkou [JP/JP]; JP (UsOnly)
林 圭治 HAYASHI, Keiji [JP/JP]; JP (UsOnly)
奥村 和人 OKUMURA, Kazuhito [JP/JP]; JP (UsOnly)
Inventors:
花木 一康 HANAKI, Ikkou; JP
林 圭治 HAYASHI, Keiji; JP
奥村 和人 OKUMURA, Kazuhito; JP
Agent:
高島 一 TAKASHIMA, Hajime; 〒5410044 大阪府大阪市中央区伏見町四丁目1番1号 明治安田生命大阪御堂筋ビル Osaka Meiji Yasuda Seimei Osaka Midosuji Bldg. 1-1, Fushimimachi 4-chome, Chuo-ku Osaka-shi, Osaka 5410044, JP
Priority Data:
2005-18721627.06.2005JP
Title (EN) SURFACE PROTECTION SHEET FOR LASER MATERIAL PROCESSING
(FR) FEUILLET DE PROTECTION DE SURFACE POUR LE TRAITEMENT PAR LASER D'UN MATÉRIAU
(JA) レーザ加工用表面保護シート
Abstract:
(EN) A surface protection sheet for laser material processing capable of protecting the surface of an object and being stuck to the surface opposite to the laser beam irradiation surface, without dross being produced easily during laser cutting machining. A surface protection sheet (1) for laser material processing being stuck to the surface opposite to the laser beam irradiation surface (2a) of a work (2) when the work (2) is cut by being irradiated with a laser beam (6), wherein the sheet has a substrate layer and an adhesive layer provided on one side thereof. The substrate layer is composed of a resin material having a melt viscosity of 200 Pa s or less measured at 290˚C based on JIS K7199(1999) and has a thickness of 0.01-0.12 mm.
(FR) L'invention concerne un feuillet de protection de surface pour un traitement de matériau par laser capable de protéger la surface d'un objet et adhérant à la surface à l'opposé de la surface d'irradiation du faisceau laser, sans production facile de scories pendant l'opération de découpe au laser. Il s'agit d'un feuillet de protection de surface (1) pour le traitement par laser d'un matériau adhérant à la surface à l'opposé de la surface d'irradiation du faisceau laser (2a) d'une pièce (2) lorsque celle-ci est coupée par irradiation par un faisceau laser (6), le feuillet ayant une couche de substrat et une couche d’adhésif sur un côté. La couche de substrat est composée d'un matériau résineux ayant une viscosité à l'état fondu de 200 Pa ou moins mesurée à 290 °C sur la base de la norme JIS K7199(1999) et ayant une épaisseur de 0,01 à 0,12 mm.
(JA) 本発明の課題は、被着体の表面を保護することができ、かつレーザ切断加工時にドロスが生じ難い、レーザビーム照射面の反対側の面に貼付することを目的とするレーザ加工用表面保護シートを提供することである。本発明では、レーザビーム6をワーク2に照射して切断加工を行う際に前記ワーク2のレーザビーム照射面2aの反対側の面に貼付するためのレーザ加工用表面保護シート1が提供され、該シートは、基材層とその片面に設けられた粘着剤層とを備え、基材層はJIS K7199(1999)に基づいて290℃で測定される溶融粘度が200Pa・s以下である樹脂材料からなり、基材層の厚さが0.01~0.12mmである。
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Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080023263EP1900470JP2007039665US20090123740CN101208172