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1. (WO2007001012) FLAT DIE AND PROCESS FOR PRODUCING LAYERED RESIN FILM OR SHEET
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2007/001012 International Application No.: PCT/JP2006/312865
Publication Date: 04.01.2007 International Filing Date: 28.06.2006
IPC:
B29C 47/14 (2006.01) ,B29C 47/04 (2006.01) ,B29L 7/00 (2006.01) ,B29L 9/00 (2006.01)
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
47
Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
08
Component parts, details or accessories; Auxiliary operations
12
Extrusion nozzles or dies
14
with broad opening, e.g. for sheets
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
C
SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
47
Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
04
of multilayered or multicoloured articles
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
L
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C59
7
Flat articles, e.g. films or sheets
B PERFORMING OPERATIONS; TRANSPORTING
29
WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
L
INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C59
9
Layered products
Applicants:
積水化学工業株式会社 SEKISUI CHEMICAL CO., LTD. [JP/JP]; 〒5308565 大阪府大阪市北区西天満2丁目4番4号 Osaka 4-4, Nishitemma 2-chome, Kita-ku, Osaka-shi Osaka 5308565, JP (AllExceptUS)
白井 健一 SHIRAI, Kenichi [JP/JP]; JP (UsOnly)
山下 裕司 YAMASHITA, Yuji [JP/JP]; JP (UsOnly)
Inventors:
白井 健一 SHIRAI, Kenichi; JP
山下 裕司 YAMASHITA, Yuji; JP
Agent:
藤田 隆 FUJITA, Takashi; 〒5300044 大阪府大阪市北区東天満2丁目10番17号 マツイビル5階 Osaka Matsui Bldg. 5F 10-17, Higashitenma 2-chome Kita-ku, Osaka-shi Osaka 530-0044, JP
Priority Data:
2005-19077329.06.2005JP
2005-23247110.08.2005JP
Title (EN) FLAT DIE AND PROCESS FOR PRODUCING LAYERED RESIN FILM OR SHEET
(FR) FILIÈRE PLATE ET PROCÉDÉ DE FABRICATION DE PELLICULE OU FEUILLE DE RÉSINE EN COUCHE
(JA) フラットダイ、並びに、積層樹脂フィルム又はシートの製造方法
Abstract:
(EN) A flat die which, even when resins differing in viscosity during molding are laminated, can give an intended thickness distribution without having a complicated structure. The flat die (1) comprises a resin introduction part (20), a manifold (21) connected to the resin introduction part (20), and a lip opening part (12). It has a protruded space (22). Thus, when different resins superposed in the thickness direction flow through the manifold (21), the resins can be made to differ from each other in the manner or degree in which the resins spread in the width direction.
(FR) La présente invention concerne une filière plate qui, même lorsque des résines de viscosité différente sont stratifiées au cours d’un moulage, peut produire une distribution d’épaisseur prévue sans structure compliquée. La filière plate (1) comprend une partie d’introduction de résine (20), un distributeur (21) raccordé à la partie d’introduction de résine (20), et une partie d’ouverture de lèvre (12). Elle comporte un espace en saillie (22). Ainsi, lorsque des résines différentes superposées dans la direction d’épaisseur s’écoulent à travers le distributeur (21), la manière dont ou le degré selon lequel les résines s’étalent dans la direction de largeur peut être différent pour chaque résine.
(JA)  成形時の粘性の異なる樹脂を積層する場合にも、構造が複雑にすることなく厚み分布を目的のものとすることが可能であるフラットダイを提供するものである。  本発明のフラットダイ(1)には、樹脂流入部(20)と、樹脂流入部(20)と接続しているマニホールド(21)と、リップ開口部(12)とを有している。そして、張出空間(22)を形成し、厚み方向に異なる種類の樹脂が積層状態でマニホールド(21)内で流れる際に、各樹脂の間で幅方向の広がり方が変わるようにすることができる。
front page image
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)
Also published as:
KR1020080023757US20090020909CN101213064