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1. (WO2007000695) PACKAGE, SUBASSEMBLY AND METHODS OF MANUFACTURING THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2007/000695    International Application No.:    PCT/IB2006/052034
Publication Date: 04.01.2007 International Filing Date: 22.06.2006
IPC:
H01L 23/36 (2006.01), H01L 21/68 (2006.01), H01L 21/48 (2006.01)
Applicants: KONINKLIJKE PHILIPS ELECTRONICS N.V. [NL/NL]; Groenewoudseweg 1, NL-5621 BA Eindhoven (NL) (For All Designated States Except US).
DEKKER, Ronald [NL/NL]; (NL) (For US Only).
MICHIELSEN, Theodorus, M. [NL/NL]; (NL) (For US Only).
MEIJER, Eduard, J. [NL/NL]; (NL) (For US Only)
Inventors: DEKKER, Ronald; (NL).
MICHIELSEN, Theodorus, M.; (NL).
MEIJER, Eduard, J.; (NL)
Agent: NOLLEN, Maarten, D-J.; Prof. Holstlaan 6, NL-5656 AA Eindhoven (NL)
Priority Data:
05105830.3 29.06.2005 EP
Title (EN) PACKAGE, SUBASSEMBLY AND METHODS OF MANUFACTURING THEREOF
(FR) BOITIER, SOUS-ENSEMBLE ET PROCEDE DE FABRICATION CORRESPONDANT
Abstract: front page image
(EN)The package (100) of the invention comprises at least one semiconductor device (30) provided with bond pads (32); an encapsulation (40), an interconnect element (20) and a heatsink (90). This element comprises a system of electrical interconnects (12) and is at least substantially covered by a thermally conductive, electrically insulating layer (11) at a first side (1) and that is provided with an electric isolation (13) at a second side (2), such that the isolation (13) and the thermally conducting layer (11) electrically isolate the electrical interconnects (12) from each other. At least one component of the encapsulation (40) and the heatsink (90) has an interface with the interconnect element (20), which interlace extends over substantially the complete side (1,2) to which the said component (40,90) is attached.
(FR)La présente invention concerne un boîtier (100) comprenant au moins un dispositif à semi-conducteur (30) pourvu de plots de contact (32), d'une inclusion (40), d'un élément d'interconnexion (20) et d'un puits thermique (90). Cet élément, qui comprend un système d'interconnexions électrique (12) est sensiblement recouvert d'un premier côté (1) d'une couche (11) électriquement isolante et thermoconductrice, et garnie d'une isolation électrique (13) de l'autre côté (2), de façon que l'isolation (13) et la couche thermoconductrice (11à isole électriquement l'une de l'autre les interconnexions électriques (12). L'un des composants au moins de l'inclusion (40) et du puits thermique (90) comporte une interface avec l'élément d'interconnexion (20), laquelle interface vient sensiblement au-dessus de la totalité du côte (1, 2) auquel tient ledit composant (40, 90).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)