WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2006127243) METHOD AND APPARATUS FOR REDUCING SURFACE DEFECTS IN MICROSTAMPS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/127243    International Application No.:    PCT/US2006/017531
Publication Date: 30.11.2006 International Filing Date: 05.05.2006
IPC:
B81C 1/00 (2006.01)
Applicants: GENERAL ELECTRIC COMPANY [US/US]; 1 River Road, Schenectady, New York 12345 (US) (For All Designated States Except US).
LIANG, Erwin Wenti [CN/US]; (US) (For US Only).
HAYDEN, Harland Lynn [US/US]; (US) (For US Only).
JACOBS, Dennis Michael [US/US]; (US) (For US Only).
COYLE, Dennis Joseph [US/US]; (US) (For US Only).
CHEN, Alvin Un-Teh [US/US]; (US) (For US Only).
SORENSEN, Donald Bruce [US/US]; (US) (For US Only).
EDWARDS, Richard Robert [US/US]; (US) (For US Only)
Inventors: LIANG, Erwin Wenti; (US).
HAYDEN, Harland Lynn; (US).
JACOBS, Dennis Michael; (US).
COYLE, Dennis Joseph; (US).
CHEN, Alvin Un-Teh; (US).
SORENSEN, Donald Bruce; (US).
EDWARDS, Richard Robert; (US)
Agent: TOOP, Barbara, A.; GENERAL ELECTRIC COMPANY, Global Patent Operation, 187 Danbury Road, Suite 204, Wilton, Connecticut 06897 (US)
Priority Data:
11/135,794 24.05.2005 US
Title (EN) METHOD AND APPARATUS FOR REDUCING SURFACE DEFECTS IN MICROSTAMPS
(FR) PROCEDE ET APPAREIL PERMETTANT DE REDUIRE DES DEFAUTS SUPERFICIELS DANS DES MICROPOINÇONS
Abstract: front page image
(EN)A removal assembly and method for removing a submaster from a master is described. A curved tooling surface is arranged within a housing of the assembly. A first array of vacuum cups is attached to the housing adjacent a first end of the curved tooling surface, where the first array of vacuum cups are configured to provide a vacuum grip on a first portion of the submaster. A second array of vacuum cups is attached to the housing adjacent a second end of the curved tooling surface, where the second end opposes the first end, the second array of vacuum cups is configured to provide a vacuum grip on a second portion of the submaster. A rotation mechanism is configured to rotationally support the master as the master is rolled along the curved tooling surface to remove the submaster.
(FR)L'invention concerne un ensemble de retrait et un procédé permettant de retirer un sous-gabarit d'un gabarit. Une surface d'usinage incurvée est située dans une enveloppe de cet ensemble. Un premier arrangement de coupelles sous vide est fixé à l'enveloppe à côté d'une première extrémité de la surface d'usinage incurvée, ce premier arrangement de coupelles sous vide étant conçu pour une prise sous vide d'une première partie du sous-gabarit. Un second arrangement de coupelles sous vide est fixé à l'enveloppe à côté d'une seconde extrémité de la surface d'usinage incurvée, cette seconde extrémité étant opposée à la première extrémité, et le second arrangement de coupelles sous vide étant conçu pour une prise sous vide d'une seconde partie du sous-gabarit. Un mécanisme de rotation est conçu pour supporter de façon rotative le gabarit alors que celui-ci est pivoté le long de la surface d'usinage incurvée pour retirer le sous-gabarit.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)