Processing

Please wait...

Settings

Settings

Goto Application

1. WO2006126279 - PROBE ASSEMBLY, METHOD OF PRODUCING THE PROBE ASSEMBLY, AND ELECTRICAL CONNECTION DEVICE

Publication Number WO/2006/126279
Publication Date 30.11.2006
International Application No. PCT/JP2005/009812
International Filing Date 23.05.2005
IPC
G01R 1/073 2006.1
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types covered by groups G01R5/-G01R13/122
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
CPC
G01R 1/07314
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
1Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
02General constructional details
06Measuring leads; Measuring probes
067Measuring probes
073Multiple probes
07307with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
07314the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
G01R 31/2889
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
28Testing of electronic circuits, e.g. by signal tracer
2851Testing of integrated circuits [IC]
2886Features relating to contacting the IC under test, e.g. probe heads; chucks
2889Interfaces, e.g. between probe and tester
Y10T 29/49204
YSECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
10TECHNICAL SUBJECTS COVERED BY FORMER USPC
TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
29Metal working
49Method of mechanical manufacture
49002Electrical device making
49117Conductor or circuit manufacturing
49204Contact or terminal manufacturing
Applicants
  • 株式会社日本マイクロニクス KABUSHIKI KAISHA NIHON MICRONICS [JP]/[JP] (AllExceptUS)
  • 三浦 清敏 MIURA, Kiyotoshi [JP]/[JP] (UsOnly)
  • 清藤 英博 KIYOFUJI, Hidehiro [JP]/[JP] (UsOnly)
  • 宮城 雄治 MIYAGI, Yuji [JP]/[JP] (UsOnly)
  • 国吉 伸治 KUNIYOSHI, Shinji [JP]/[JP] (UsOnly)
  • 佐藤 仁 SATO, Hitoshi [JP]/[JP] (UsOnly)
Inventors
  • 三浦 清敏 MIURA, Kiyotoshi
  • 清藤 英博 KIYOFUJI, Hidehiro
  • 宮城 雄治 MIYAGI, Yuji
  • 国吉 伸治 KUNIYOSHI, Shinji
  • 佐藤 仁 SATO, Hitoshi
Agents
  • 松永 宣行 MATSUNAGA, Nobuyuki
Priority Data
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) PROBE ASSEMBLY, METHOD OF PRODUCING THE PROBE ASSEMBLY, AND ELECTRICAL CONNECTION DEVICE
(FR) ENSEMBLE SONDE ET SON PROCEDE DE PRODUCTION ET DISPOSITIF DE CONNEXION ELECTRIQUE
(JA) プローブ組立体、その製造方法および電気的接続装置
Abstract
(EN) A probe assembly used for electrical measurement of an object to be inspected. The probe assembly has a probe board and probes, the probe board having bent deformation in a free state where the board receives no load, the probes being formed on one surface of the board in a manner projecting from the one surface. Forward ends of all the probes are positioned, with the deformation of the probe board maintained, on the same plane parallel to an imaginary standard plane.
(FR) L’invention concerne un ensemble sonde servant à la mesure électrique d’un objet à contrôler. Cet ensemble comprend une plaque de sonde et des sondes, ladite plaque présentant une courbure en état vide où elle ne reçoit aucune charge et les sondes étant formées sur une surface de la plaque en saillie par rapport à celle-ci. Les extrémités avant de toutes les sondes sont placées, la courbure de la plaque de sonde étant maintenue, sur le même plan parallèle à un plan standard fictif.
(JA)  被検査体の電気的測定に用いられるプローブ組立体。プローブ組立体は、負荷を受けない自由状態で曲がり変形を生じた平板状のプローブ基板と、該プローブ基板の一方の面に該面から突出して形成された複数のプローブとを備える。全ての前記プローブの先端は、前記プローブ基板の前記変形を保持した状態で、仮想基準面に平行な同一平面上に位置する。
Related patent documents
EP5743592This application is not viewable in PATENTSCOPE because the national phase entry has not been published yet or the national entry is issued from a country that does not share data with WIPO or there is a formatting issue or an unavailability of the application.
Latest bibliographic data on file with the International Bureau