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1. (WO2006126279) PROBE ASSEMBLY, METHOD OF PRODUCING THE PROBE ASSEMBLY, AND ELECTRICAL CONNECTION DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/126279    International Application No.:    PCT/JP2005/009812
Publication Date: 30.11.2006 International Filing Date: 23.05.2005
IPC:
G01R 1/073 (2006.01)
Applicants: KABUSHIKI KAISHA NIHON MICRONICS [JP/JP]; 6-8, Kichijojihoncho 2-chome, Musashino-shi, Tokyo 1800004 (JP) (For All Designated States Except US).
MIURA, Kiyotoshi [JP/JP]; (JP) (For US Only).
KIYOFUJI, Hidehiro [JP/JP]; (JP) (For US Only).
MIYAGI, Yuji [JP/JP]; (JP) (For US Only).
KUNIYOSHI, Shinji [JP/JP]; (JP) (For US Only).
SATO, Hitoshi [JP/JP]; (JP) (For US Only)
Inventors: MIURA, Kiyotoshi; (JP).
KIYOFUJI, Hidehiro; (JP).
MIYAGI, Yuji; (JP).
KUNIYOSHI, Shinji; (JP).
SATO, Hitoshi; (JP)
Agent: MATSUNAGA, Nobuyuki; Urban Toranomon Building 7F, 16-4, Toranomon 1-chome Minato-ku, Tokyo 1050001 (JP)
Priority Data:
Title (EN) PROBE ASSEMBLY, METHOD OF PRODUCING THE PROBE ASSEMBLY, AND ELECTRICAL CONNECTION DEVICE
(FR) ENSEMBLE SONDE ET SON PROCEDE DE PRODUCTION ET DISPOSITIF DE CONNEXION ELECTRIQUE
(JA) プローブ組立体、その製造方法および電気的接続装置
Abstract: front page image
(EN)A probe assembly used for electrical measurement of an object to be inspected. The probe assembly has a probe board and probes, the probe board having bent deformation in a free state where the board receives no load, the probes being formed on one surface of the board in a manner projecting from the one surface. Forward ends of all the probes are positioned, with the deformation of the probe board maintained, on the same plane parallel to an imaginary standard plane.
(FR)L’invention concerne un ensemble sonde servant à la mesure électrique d’un objet à contrôler. Cet ensemble comprend une plaque de sonde et des sondes, ladite plaque présentant une courbure en état vide où elle ne reçoit aucune charge et les sondes étant formées sur une surface de la plaque en saillie par rapport à celle-ci. Les extrémités avant de toutes les sondes sont placées, la courbure de la plaque de sonde étant maintenue, sur le même plan parallèle à un plan standard fictif.
(JA) 被検査体の電気的測定に用いられるプローブ組立体。プローブ組立体は、負荷を受けない自由状態で曲がり変形を生じた平板状のプローブ基板と、該プローブ基板の一方の面に該面から突出して形成された複数のプローブとを備える。全ての前記プローブの先端は、前記プローブ基板の前記変形を保持した状態で、仮想基準面に平行な同一平面上に位置する。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)