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1. (WO2006124864) IMPEDANCE CONTROLLED VIA STRUCTURE

Pub. No.:    WO/2006/124864    International Application No.:    PCT/US2006/018870
Publication Date: Nov 23, 2006 International Filing Date: May 15, 2006
IPC: H05K 1/02
Applicants: TERADYNE, INC.
BEHZIZ, Arash
Inventors: BEHZIZ, Arash
Title: IMPEDANCE CONTROLLED VIA STRUCTURE
Abstract:
In one embodiment, a via structure for a printed circuit board is provided which includes a signal via and an elongated signal conductor strip in electrical connection with the signal via. The elongated signal conductor strip is adjacent to a ground conductor and extends from the conductive pad substantially to the ground conductor. The elongated signal conductor strip includes a portion extending laterally outward, which may be configured to have a capacitance so as to establish an impedance for the via structure.