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1. (WO2006123298) THROUGH-WAFER INTERCONNECTION

Pub. No.:    WO/2006/123298    International Application No.:    PCT/IB2006/051566
Publication Date: Nov 23, 2006 International Filing Date: May 18, 2006
IPC: H01L 21/44
H01L 29/43
Applicants: KOLO TECHNOLOGIES, INC.
HUANG, Yongli
Inventors: HUANG, Yongli
Title: THROUGH-WAFER INTERCONNECTION
Abstract:
A through-wafer interconnect and a method for fabricating the same are disclosed. The method starts with a conductive wafer (300) to form a patterned trench by removing material of the conductive wafer. The patterned trench extends in depth from the front side to the backside of the wafer, and has an annular opening generally dividing the conductive wafer into an inner portion and an outer portion whereby the inner portion of the conductive wafer is insulated from the outer portion and serves as a through-wafer conductor (310). A dielectric material (320) is formed or added into the patterned trench mechanical to support and electrically insulate the through-wafer conductor. Multiple conductors can be formed in an array.