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1. WO2006122125 - MAGNETIC ASSIST MANUFACTURING TO REDUCE MOLD FLASH AND ASSIST WITH HEAT SLUG ASSEMBLY

Publication Number WO/2006/122125
Publication Date 16.11.2006
International Application No. PCT/US2006/017932
International Filing Date 10.05.2006
IPC
H01L 21/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/565
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, ; e.g. sealing of a cap to a base of a container
56Encapsulations, e.g. encapsulation layers, coatings
565Moulds
H01L 2224/48247
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48245the item being metallic
48247connecting the wire to a bond pad of the item
H01L 23/4334
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
4334Auxiliary members in encapsulations
H01L 24/48
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
H01L 2924/00014
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00014the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
H01L 2924/01046
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01046Palladium [Pd]
Applicants
  • TEXAS INSTRUMENTS INCORPORATED [US]/[US] (AllExceptUS)
  • KUMMERL, Steven, Alfred [US]/[US] (UsOnly)
  • LANGE, Bernhard, Peter [DE]/[US] (UsOnly)
Inventors
  • KUMMERL, Steven, Alfred
  • LANGE, Bernhard, Peter
Agents
  • FRANZ, Warren, L.
Priority Data
11/125,71210.05.2005US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MAGNETIC ASSIST MANUFACTURING TO REDUCE MOLD FLASH AND ASSIST WITH HEAT SLUG ASSEMBLY
(FR) FABRICATION A ASSISTANCE MAGNETIQUE PERMETTANT DE REDUIRE LA BAVURE DE MOULAGE ET AIDER A L'ASSEMBLAGE DE PONT THERMIQUE
Abstract
(EN) A method (300) and apparatus (200) for fabricating a semiconductor package (100), wherein a heat spreader (118) is placed in a mold cavity (204) of a mold (202), and a leadframe (108) is placed over the heat spreader (118). A magnetic field (218) is applied to the mold cavity (204), wherein one or more of the heat spreader (118) and leadframe (108) are generally attracted to a surface (212) of the mold cavity (204), thus generally determining. a position (214) of the heat spreader (118) within the mold cavity (204) and defining a contact region (120) between the heat spreader (118) and the mold (202). An encapsulation material (114) is further injected into the mold cavity (204), wherein the encapsulation material (114) is generally prevented from entering the contact region (120) due, at least in part, to the applied magnetic field (218). The encapsulation material (114) is then cured, and the semiconductor package (100) is removed from the mold cavity (204).
(FR) La présente invention concerne un procédé et un appareil (200) permettant de fabriquer un boîtier semi-conducteur, dans lequel un diffuseur thermique (118) est placé dans une cavité de moule (204) et une grille de connexion (108) est placée sur ce diffuseur thermique. Un champ magnétique (218) est appliqué sur la cavité de moule, le diffuseur thermique et/ou la grille de connexion étant généralement attirés vers la surface (212) de la cavité de moules, déterminant généralement une position (214) du diffuseur thermique à l'intérieur de cette cavité et définissant une région de contact (120) entre le diffuseur thermique et la cavité. Un matériau d'encapsulation est ensuite injecté dans la cavité de moule, ce matériau d'encapsulation étant généralement empêché d'entrer dans la région de contact au moins en partie du fait du champ magnétique appliqué. Le matériau d'encapsulation est ensuite durci et le boîtier semi-conducteur est retiré de la cavité de moule.
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