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1. WO2006118679 - PACKAGE FOR AN IMPLANTABLE NEURAL STIMULATION DEVICE

Publication Number WO/2006/118679
Publication Date 09.11.2006
International Application No. PCT/US2006/010041
International Filing Date 20.03.2006
IPC
A61N 1/36 2006.01
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
18Applying electric currents by contact electrodes
32alternating or intermittent currents
36for stimulation, e.g. heart pace-makers
CPC
A61N 1/0543
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
02Details
04Electrodes
05for implantation or insertion into the body, e.g. heart electrode
0526Head electrodes
0543Retinal electrodes
A61N 1/36046
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
18Applying electric currents by contact electrodes
32alternating or intermittent currents
36for stimulation
36046of the eye
A61N 1/375
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
18Applying electric currents by contact electrodes
32alternating or intermittent currents
36for stimulation
372Arrangements in connection with the implantation of stimulators
375Constructional arrangements, e.g. casings
A61N 1/37518
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
18Applying electric currents by contact electrodes
32alternating or intermittent currents
36for stimulation
372Arrangements in connection with the implantation of stimulators
375Constructional arrangements, e.g. casings
37518Anchoring of the implants, e.g. fixation
A61N 1/3758
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
18Applying electric currents by contact electrodes
32alternating or intermittent currents
36for stimulation
372Arrangements in connection with the implantation of stimulators
375Constructional arrangements, e.g. casings
3758Packaging of the components within the casing
A61N 1/3787
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
1Electrotherapy; Circuits therefor
18Applying electric currents by contact electrodes
32alternating or intermittent currents
36for stimulation
372Arrangements in connection with the implantation of stimulators
378Electrical supply
3787from an external energy source
Applicants
  • SECOND SIGHT MEDICAL PRODUCTS, INC. [US]/[US] (AllExceptUS)
  • GREENBERG, Robert, J. [US]/[US] (UsOnly)
  • NEYSMITH, Jordan [CA]/[US] (UsOnly)
  • WILKIN, Kevin [US]/[US] (UsOnly)
  • OK, Jerry [US]/[US] (UsOnly)
Inventors
  • GREENBERG, Robert, J.
  • NEYSMITH, Jordan
  • WILKIN, Kevin
  • OK, Jerry
Agents
  • LENDVAI, Tomas
Priority Data
60/675,98028.04.2005US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PACKAGE FOR AN IMPLANTABLE NEURAL STIMULATION DEVICE
(FR) BOITIER CONÇU POUR UN DISPOSITIF DE STIMULATION NEURONALE IMPLANTABLE
Abstract
(EN)
The present invention is an improved hermetic package for implantation in the human body. The implantable device of the present invention includes an eclectically non-conductive bass including electrically conductive vias through the substrate. A circuit is flip-chip bonded to a subset of the vias. A second circuit is wire bonded to another subset of the vias. Finally, a cover is bonded to the substrate such that the cover, substrate and vias form a hermetic package.
(FR)
L'invention concerne un boîtier hermétique amélioré destiné à être implanté dans le corps humain. Ce dispositif implantable comprend un substrat non électroconducteur comportant des trous d'interconnexion électroconducteurs qui sont ménagés dans le substrat. Un circuit est relié à un sous-ensemble de trous d'interconnexion par l'intermédiaire de billes. Un deuxième circuit est relié à un autre sous-ensemble de trous d'interconnexion par l'intermédiaire de fils. Enfin, un élément de recouvrement est relié au substrat de sorte que cet élément de recouvrement, le substrat, et les trous d'interconnexion forment un boîtier hermétique.
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