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1. WO2006117447 - METHOD OF PRODUCING A WALL, PARTICULARLY A WALL OF A MICRO HEAT EXCHANGER, AND MICRO HEAT EXCHANGER COMPRISING, IN PARTICULAR, NANOTUBES

Publication Number WO/2006/117447
Publication Date 09.11.2006
International Application No. PCT/FR2006/000862
International Filing Date 19.04.2006
IPC
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 23/373 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H01L 23/367 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
367Cooling facilitated by shape of device
CPC
F28F 13/185
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
13Arrangements for modifying heat-transfer, e.g. increasing, decreasing
18by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
185Heat-exchange surfaces provided with microstructures or with porous coatings
H01L 23/3677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
367Cooling facilitated by shape of device
3677Wire-like or pin-like cooling fins or heat sinks
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • UNIVERSITE JOSEPH FOURIER [FR]/[FR] (AllExceptUS)
  • COMMISSARIAT A L'ENERGIE ATOMIQUE [FR]/[FR] (AllExceptUS)
  • CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS( [FR]/[FR] (AllExceptUS)
  • BONTEMPS, André [FR]/[FR] (UsOnly)
  • AYELA, Frédéric [FR]/[FR] (UsOnly)
  • MARECHAL, Alain [FR]/[FR] (UsOnly)
  • FOURNIER, Thierry [FR]/[FR] (UsOnly)
Inventors
  • BONTEMPS, André
  • AYELA, Frédéric
  • MARECHAL, Alain
  • FOURNIER, Thierry
Agents
  • CASALONGA, Axel
Priority Data
050434029.04.2005FR
Publication Language French (FR)
Filing Language French (FR)
Designated States
Title
(EN) METHOD OF PRODUCING A WALL, PARTICULARLY A WALL OF A MICRO HEAT EXCHANGER, AND MICRO HEAT EXCHANGER COMPRISING, IN PARTICULAR, NANOTUBES
(FR) PROCEDE DE REALISATION D'UNE PAROI, EN PARTICULIER D'UN MICRO-ECHANGEUR THERMIQUE, ET MICRO-ECHANGEUR THERMIQUE, COMPRENANT EN PARTICULIER DES NANOTUBES
Abstract
(EN)
The invention relates to a method of producing a wall, particularly a wall for a micro heat exchanger for semiconductor devices or microsystems, and to a micro heat exchanger, in which particles (9) are embedded in a layer (4), some of said particles having one part (9a) which is anchored in a wall of the aforementioned layer and another part (9b) which projects out in relation to said wall (6) once the material has been removed.
(FR)
Procédé de réalisation d'une paroi, en particulier d'un micro- échangeur thermique pour dispositifs semi-conducteurs ou micro¬ systèmes, et micro-échangeur thermique, dans lesquels des particules (9) sont noyées dans une couche (4), dont certaines présentent une partie (9a) ancrée dans une paroi de ladite couche et une partie (9b) en saillie par rapport à cette paroi (6) après enlèvement de matériau.
Also published as
Latest bibliographic data on file with the International Bureau