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Machine translation
1. (WO2006116739) ELECTRET CONDENSER MICROPHONE AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/116739    International Application No.:    PCT/US2006/016435
Publication Date: 02.11.2006 International Filing Date: 27.04.2006
IPC:
H04R 19/01 (2006.01)
Applicants: KNOWLES ELECTRONICS, LLC [US/US]; 1151 Maplewood Drive, Itasca, IL 60143 (US) (For All Designated States Except US).
HSIEH, Yung, Chuan [CN/CN]; (TW) (For US Only).
CHEN, Chuh, Yan [CN/CN]; (TW) (For US Only).
FENG, Jen, Nan [CN/CN]; (TW) (For US Only).
TSENG, Yu, Ling [CN/CN]; (TW) (For US Only)
Inventors: HSIEH, Yung, Chuan; (TW).
CHEN, Chuh, Yan; (TW).
FENG, Jen, Nan; (TW).
TSENG, Yu, Ling; (TW)
Agent: SITKO, Anthony, G.; Marshall, Gerstein & Borun LLP, 233 S. Wacker Drive, Suite 6300, Sears Tower, Chicago, IL 60606-6357 (US)
Priority Data:
60/675,209 27.04.2005 US
11/131,969 18.05.2005 US
Title (EN) ELECTRET CONDENSER MICROPHONE AND MANUFACTURING METHOD THEREOF
(FR) MICROPHONE A CONDENSATEUR ELECTRET ET SON PROCEDE DE PRODUCTION
Abstract: front page image
(EN)A microphone includes a housing, an acoustic port formed in the housing, a diaphragm disposed within the housing adjacent the acoustic port, a backplate assembly operably disposed within the housing in spaced relationship relative to the diaphragm and a circuit assembly disposed within the housing. A connecting member extends between the circuit assembly and the backplate assembly to secure mechanically the backplate assembly within the housing and to couple electrically the backplate assembly to the circuit assembly.
(FR)L'invention concerne un microphone comprenant un boîtier, un port acoustique réalisé dans le boîtier, un diaphragme placé dans le boîtier de manière adjacente au port acoustique, un ensemble plaque arrière placé de manière opérationnelle dans le boîtier à une certaine distance du diaphragme, et un ensemble circuit placé dans le boîtier. Un élément de connexion, s'étendant entre l'ensemble circuit et l'ensemble plaque arrière, permet de fixer mécaniquement l'ensemble plaque arrière dans le boîtier et de coupler électriquement l'ensemble plaque arrière à l'ensemble circuit.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)