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1. WO2006116690 - MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME

Publication Number WO/2006/116690
Publication Date 02.11.2006
International Application No. PCT/US2006/016257
International Filing Date 27.04.2006
Chapter 2 Demand Filed 08.11.2006
IPC
H01L 35/28 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
CPC
H01L 23/38
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
38Cooling arrangements using the Peltier effect
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 35/26
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
12Selection of the material for the legs of the junction
26using compositions changing continuously or discontinuously inside the material
H01L 35/30
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
30characterised by the heat-exchanging means at the junction
H01L 35/32
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
28operating with Peltier or Seebeck effect only
32characterised by the structure or configuration of the cell or thermo-couple forming the device ; including details about, e.g., housing, insulation, geometry, module
H01L 35/34
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
35Thermoelectric devices comprising a junction of dissimilar materials, i.e. exhibiting Seebeck or Peltier effect with or without other thermoelectric effects or thermomagnetic effects; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
34Processes or apparatus specially adapted for peculiar to the manufacture or treatment of these devices or of parts thereof
Applicants
  • COOL SHIELD, INC. [US]/[US] (AllExceptUS)
Inventors
  • MCCULLOUGH, Kevin, A.
Agents
  • JOSEPHS, David, R.
Priority Data
11/380,30026.04.2006US
60/675,78628.04.2005US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) MOLDABLE PELTIER THERMAL TRANSFER DEVICE AND METHOD OF MANUFACTURING SAME
(FR) DISPOSITIF DE TRANSFERT THERMIQUE PELTIER MOULABLE ET PROCEDE DE FABRICATION ASSOCIE
Abstract
(EN) A thermal transfer device (100) includes a body member (110) having a base material (102) of a first semiconductor material of a first type with a filler material (104) dispersed therein of a second semiconductor material of a second type. Electrodes (106, 108) are attached on sides of the body member (110) and electrical current is run therethrough to create thermal flow using the Peltier effect. The device (100) is formed by injection molding and the like and the filler (104) is introduced into the base by, for example, extrusion or pultrusion processes.
(FR) L'invention concerne un dispositif de transfert thermique (100) comprenant un élément corps (110) comportant un matériau de base (102) d'un premier matériau semiconducteur d'un premier type, un matériau de remplissage (104) étant dispersé à l'intérieur, ce matériau de remplissage étant un deuxième matériau semiconducteur d'un deuxième type. Des électrodes (106, 108) sont fixées sur des côtés de l'élément corps (110) et un courant électrique traverse ledit élément pour créer un flux thermique au moyen de l'effet Peltier. Le dispositif (100) selon l'invention est obtenu par moulage par injection et analogue, et le remplissage (104) est introduit dans la base par la mise en oeuvre de procédés d'extrusion ou de pultrusion, par exemple.
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