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1. (WO2006116280) CHIP-SCALE PACKAGE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/116280    International Application No.:    PCT/US2006/015427
Publication Date: 02.11.2006 International Filing Date: 24.04.2006
H01L 23/24 (2006.01)
Applicants: INTERNATIONAL RECTIFIER CORPORATION [US/US]; 233 Kansas Street, El Segundo, CA 90245 (US) (For All Designated States Except US).
CHIOLA, Davide [IT/US]; (US) (For US Only)
Inventors: CHIOLA, Davide; (US)
Agent: SALEHI, Kourosh; Ostrolenk, Faber, Gerb & Soffen, LLP, 1180 Avenue of the Americas, New York, NY 10036 (US)
Priority Data:
60/674,390 22.04.2005 US
Abstract: front page image
(EN)A semiconductor package including a conductive clip preferably in the shape of a can, a semiconductor die, and a conductive stack interposed between the die and the interior of the can which includes a conductive platform and a conductive adhesive body.
(FR)L'invention se rapporte à un boîtier de semi-conducteurs comprenant un pince conductrice ayant de préférence la forme d'un boîtier, une puce semi-conductrice et un empilage conducteur disposé entre la puce et l'intérieur du boîtier qui comprend une plate-forme conductrice et un corps adhésif conducteur.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)