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Machine translation
1. (WO2006116250) SEMICONDUCTOR DEVICE PACKAGES WITH SUBSTRATES FOR REDISTRIBUTING SEMICONDUCTOR DEVICE ELECTRODES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/116250    International Application No.:    PCT/US2006/015377
Publication Date: 02.11.2006 International Filing Date: 25.04.2006
IPC:
H01L 23/48 (2006.01)
Applicants: INTERNATIONAL RECTIFIER CORPORATION [US/US]; 233 Kansas Street, El Segundo, California 90245 (US) (For All Designated States Except US).
CONNAH, Norman Glyn [GB/GB]; (GB) (For US Only)
Inventors: CONNAH, Norman Glyn; (GB).
PAVIER, Mark; (GB).
ADAMSON, Phillip; (GB).
SCHOFIELD, Hazel D.; (GB)
Agent: WEINER, Samuel, H.; Ostrolenk, Faber, Gerb & Soffen LLP, 1180 Avenue Of The Americas, New York, NY 10036 (US)
Priority Data:
60/674,616 25.04.2005 US
Title (EN) SEMICONDUCTOR DEVICE PACKAGES WITH SUBSTRATES FOR REDISTRIBUTING SEMICONDUCTOR DEVICE ELECTRODES
(FR) BOITIERS DE DISPOSITIF A SEMI-CONDUCTEUR COMPORTANT DES SUBSTRATS SERVANT A REDISTRIBUER LES ELECTRODES DE CE DISPOSITIF
Abstract: front page image
(EN)A semiconductor device package includes a substrate with one or more pads and at least one semiconductor device that has one or more of its electrodes electrically connected to the substrate pads. The package also includes one or more terminals in electrical connection with the substrate pads and that provide for external connection to the device.
(FR)Boîtiers de dispositif à semi-conducteur comprenant un substrat pourvu d'une ou plusieurs plages de métallisation et au moins un dispositif à semi-conducteur dont une ou plusieurs des électrodes sont couplées aux plages de métallisation du substrat. Ce boîtier comprend également une ou plusieurs bornes couplées aux plages de métallisation du substrat et constituant un branchement extérieur pour le dispositif.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)