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Machine translation
1. (WO2006116249) DEVICE PACKAGES HAVING A III-NITRIDE BASED POWER SEMICONDUCTOR DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/116249    International Application No.:    PCT/US2006/015376
Publication Date: 02.11.2006 International Filing Date: 25.04.2006
IPC:
H01L 23/02 (2006.01)
Applicants: INTERNATIONAL RECTIFIER CORPORATION [US/US]; 233 Kansas Street, El Segundo, California 90245 (US) (For All Designated States Except US).
PAVIER, Mark [GB/GB]; (GB) (For US Only)
Inventors: PAVIER, Mark; (GB).
CONNAH, Norman Glyn; (GB)
Agent: WEINER, Samuel, H.; Ostrolenk, Faber, Gerb & Soffen LLP, 1180 Avenue Of The Americas, New York, New York 10036 (US)
Priority Data:
60/674,616 25.04.2005 US
Title (EN) DEVICE PACKAGES HAVING A III-NITRIDE BASED POWER SEMICONDUCTOR DEVICE
(FR) BOITIERS CONTENANT UN COMPOSANT A SEMI-CONDUCTEUR A BASE DE NITRURE III
Abstract: front page image
(EN)A semiconductor device package includes a die pad, a substrate disposed on the die pad, and a III-nitride based semiconductor device disposed on the substrate. The device package may also include a second semiconductor device disposed on the die pad or the substrate, which device may be electrically connected to the III-nitride based device to form a circuit.
(FR)Boîtier de composant à semi-conducteur comprenant une plage de connexion de puce, un substrat situé sur cette plage de connexion de puce et un composant à semi-conducteur à base de nitrure III placé sur le substrat. Ce boîtier de composant peut également contenir un deuxième composant à semi-conducteur placé sur la plage de connexion de puce ou sur le substrat, ce composant pouvant être couplé au composant à base de nitrure III afin de créer un circuit.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)