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1. (WO2006116162) SEMICONDUCTOR PACKAGE

Pub. No.:    WO/2006/116162    International Application No.:    PCT/US2006/015205
Publication Date: Nov 2, 2006 International Filing Date: Apr 21, 2006
IPC: H01L 23/12
H01L 23/043
H01L 23/10
H01L 29/00
H01L 21/44
H01L 21/48
H01L 21/50
Applicants: INTERNATIONAL RECTIFIER CORPORATION
STANDING, Martin
Inventors: STANDING, Martin
Title: SEMICONDUCTOR PACKAGE
Abstract:
A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.