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1. (WO2006115924) MULTI-LAYER POLISHING PAD MATERIAL FOR CMP
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/115924    International Application No.:    PCT/US2006/014674
Publication Date: 02.11.2006 International Filing Date: 19.04.2006
IPC:
B24D 3/32 (2006.01), B24B 7/30 (2006.01), B24D 13/14 (2006.01)
Applicants: CABOT MICROELECTRONICS CORPORATION [US/US]; 870 North Commons Drive, Aurora, Illinois 60504 (US)
Inventors: PRASAD, Abaneshwar; (US).
LACY, Michael; (US)
Agent: WESEMAN, Steven; Legal Department, Cabot Microelectronics Corporation, 870 North Commons Drive, Aurora, IL 60504 (US)
Priority Data:
11/113,498 25.04.2005 US
Title (EN) MULTI-LAYER POLISHING PAD MATERIAL FOR CMP
(FR) MATERIAU DE TAMPON A POLIR MULTICOUCHE DESTINE A CMP
Abstract: front page image
(EN)The invention is directed to a multi-layer polishing pad (10) for chemical- mechanical polishing comprising a porous polishing layer (12) and a porous bottom layer (14) , wherein the bottom layer (14) is substantially coextensive with the polishing layer (12) , the polishing layer (12) being joined to the bottom layer without the use of an adhesive; the polishing layer (12) having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.
(FR)L'invention concerne un tampon à polir multicouche destiné au polissage chimique-mécanique et comprenant une couche de polissage poreuse et une couche inférieure poreuse, la couche inférieure étant sensiblement coextensive avec la couche de polissage assemblée à la couche inférieure sans adhésif; la couche de polissage présentant une rugosité de surface moyenne Ra supérieure à celle de la couche inférieure.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)