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1. WO2006102318 - ELECTROLESS DEPOSITION PROCESS ON A CONTACT CONTAINING SILICON OR SILICIDE

Publication Number WO/2006/102318
Publication Date 28.09.2006
International Application No. PCT/US2006/010220
International Filing Date 20.03.2006
IPC
C23C 18/34 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
32Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals
34using reducing agents
C23C 18/36 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, i.e. electroless plating
31Coating with metals
32Coating with one of iron, cobalt or nickel; Coating with mixtures of phosphorus or boron with one of these metals
34using reducing agents
36using hypophosphites
CPC
B82Y 30/00
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
30Nanotechnology for materials or surface science, e.g. nanocomposites
C23C 18/1651
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
1601Process or apparatus
1633Process of electroless plating
1646Characteristics of the product obtained
165Multilayered product
1651Two or more layers only obtained by electroless plating
C23C 18/1893
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
18Pretreatment of the material to be coated
1851of surfaces of non-metallic or semiconducting in organic material
1872by chemical pretreatment
1886Multistep pretreatment
1893with use of organic or inorganic compounds other than metals, first
C23C 18/32
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
C23C 18/34
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
16by reduction or substitution, e.g. electroless plating
31Coating with metals
32Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
34using reducing agents
H01L 21/02063
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
02041Cleaning
02057Cleaning during device manufacture
0206during, before or after processing of insulating layers
02063the processing being the formation of vias or contact holes
Applicants
  • APPLIED MATERIALS, INC. [US]/[US] (AllExceptUS)
  • STEWART, Michael P. [US]/[US] (UsOnly)
  • WEIDMAN, Timothy W. [US]/[US] (UsOnly)
  • SHANMUGASUNDRAM, Arulkumar [IN]/[US] (UsOnly)
  • ZHU, Zhize [CN]/[US] (UsOnly)
  • GANDIKOTA, Srinivas [US]/[US] (UsOnly)
  • GELATOS, Avgerinos V. (Jerry) [US]/[US] (UsOnly)
  • ROSATO, John J. [US]/[US] (UsOnly)
  • EAGLESHAM, David J. [US]/[US] (UsOnly)
Inventors
  • STEWART, Michael P.
  • WEIDMAN, Timothy W.
  • SHANMUGASUNDRAM, Arulkumar
  • ZHU, Zhize
  • GANDIKOTA, Srinivas
  • GELATOS, Avgerinos V. (Jerry)
  • ROSATO, John J.
  • EAGLESHAM, David J.
Agents
  • PATTERSON, B. Todd
Priority Data
60/663,49318.03.2005US
60/683,59923.05.2005US
60/703,53829.07.2005US
60/703,63329.07.2005US
60/709,56419.08.2005US
60/731,62428.10.2005US
60/754,23027.12.2005US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ELECTROLESS DEPOSITION PROCESS ON A CONTACT CONTAINING SILICON OR SILICIDE
(FR) PROCEDE DE DEPOT AUTOCATALYTIQUE SUR UN CONTACT CONTENANT DU SILICIUM OU DU SILICIURE
Abstract
(EN)
Embodiments as described herein provide methods for depositing a material on a substrate (300) during electroless deposition processes, as well as compositions of the electroless deposition solutions. In one embodiment, the substrate (300)contains a contact aperture (310) having an exposed silicon contact surface (314). In another embodiment, the substrate (300) contains a contact aperture (310)having an exposed suicide contact surface (315). The apertures (310) are filled with a metal contact material (320) by exposing the substrate (300) to an electroless deposition process. The metal contact material (320) may contain a cobalt material, a nickel material, or alloys thereof. Prior to filling the apertures (310), the substrate may be exposed to a variety of pretreatment processes and activations processes. A preclean process may remove organic residues, native oxides, and other contaminants during a wet clean process or a plasma etch process. Embodiments of the process also provide the deposition of additional layers, such as a capping layer (318).
(FR)
L'invention concerne des procédés permettant de déposer un matériau sur un substrat pendant des procédés de dépôt autocatalytique ainsi que des compositions de solutions de dépôt autocatalytique. Dans un mode de réalisation, le substrat contient une ouverture de contact présentant une surface de contact exposée en silicium. Dans un autre mode de réalisation, le substrat contient une ouverture de contact présentant une surface de contact exposée en siliciure. Pour remplir les ouvertures d'un matériau de contact métallique, on expose le substrat à un procédé de dépôt autocatalytique. Le matériau de contact métallique peut contenir du cobalt, du nickel ou des alliages de ceux-ci. Avant de remplir les ouvertures, le substrat peut être exposé à divers procédés de prétraitement, tels que des procédés de prénettoyage et des procédés d'activation. Un procédé de prénettoyage peut enlever les résidus organiques, les oxydes natifs et d'autres contaminants pendant un procédé de nettoyage liquide ou un procédé de marquage au plasma. Les modes de réalisation du procédé selon l'invention assurent également le dépôt de couches supplémentaires, telles qu'une couche de coiffe.
Also published as
EP6739127
Latest bibliographic data on file with the International Bureau