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1. WO2006101067 - SWITCH ARRAY

Publication Number WO/2006/101067
Publication Date 28.09.2006
International Application No. PCT/JP2006/305517
International Filing Date 20.03.2006
IPC
H01H 1/26 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
12characterised by the manner in which co-operating contacts engage
14by abutting
24with resilient mounting
26with spring blade support
B81B 3/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
B81B 7/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
7Microstructural systems
04Networks or arrays of similar microstructural devices
CPC
B81B 2201/014
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2201Specific applications of microelectromechanical systems
01Switches
012characterised by the shape
014having a cantilever fixed on one side connected to one or more dimples
B81B 2203/053
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
2203Basic microelectromechanical structures
05Type of movement
053Translation according to an axis perpendicular to the substrate
B81B 3/0054
BPERFORMING OPERATIONS; TRANSPORTING
81MICROSTRUCTURAL TECHNOLOGY
BMICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
3Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
0035Constitution or structural means for controlling the movement of the flexible or deformable elements
0054For holding or placing an element in a given position
H01H 1/0036
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
0036Switches making use of microelectromechanical systems [MEMS] ;
H01H 1/24
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
12characterised by the manner in which co-operating contacts engage
14by abutting
24with resilient mounting
H01H 2001/0042
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
HELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
1Contacts
0036Switches making use of microelectromechanical systems [MEMS] ;
0042Bistable switches, i.e. having two stable positions requiring only actuating energy for switching between them, e.g. with snap membrane or by permanent magnet
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP] (AllExceptUS)
  • 株式会社オクテック Octec Inc. [JP]/[JP] (AllExceptUS)
  • 林 聖人 HAYASHI, Masato [JP]/[JP] (UsOnly)
  • 八壁 正巳 YAKABE, Masami [JP]/[JP] (UsOnly)
  • 長谷部 鉄也 HASEBE, Tetsuya [JP]/[JP] (UsOnly)
  • 原田 宗生 HARADA, Muneo [JP]/[JP] (UsOnly)
  • 奥村 勝弥 OKUMURA, Katsuya [JP]/[JP] (UsOnly)
Inventors
  • 林 聖人 HAYASHI, Masato
  • 八壁 正巳 YAKABE, Masami
  • 長谷部 鉄也 HASEBE, Tetsuya
  • 原田 宗生 HARADA, Muneo
  • 奥村 勝弥 OKUMURA, Katsuya
Agents
  • 伊藤 英彦 ITOH, Hidehiko
Priority Data
2005-08212122.03.2005JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) SWITCH ARRAY
(FR) MATRICE DE COMMUTATION
(JA) スイッチアレイ
Abstract
(EN)
A first wiring layer (16) is provided on an insulation film (14) on the lower face of an upper substrate (15), a second wiring layer (13) crossing the first wiring layer (16) in a three-dimensional manner is provided on an insulation film (12) on a lower substrate (11), one end of a cantilever (17) is connected to the first wiring layer (16), and the other end of the cantilever (17) is positioned to face the second insulation layer (13) with a space in between. A thermoplastic sheet (19) is placed on the upper substrate (15) so as to cover a through-hole (18), and the thermoplastic sheet (19) is pressed against the cantilever (17) by a heated pin (20) to deform the thermoplastic sheet (19), thereby a switch (10) is closed with the connection of the cantilever (17) to the second wiring layer (13) maintained.
(FR)
Selon l’invention, une première couche de câblage (16) est formée sur un film isolant (14) sur la face inférieure d’un substrat supérieur (15), une deuxième couche de câblage (13) traversant la première couche de câblage (16) dans les trois dimensions est formée sur un film isolant (12) sur un substrat inférieur (11), une extrémité d’un élément en porte-à-faux (17) est connectée à la première couche de câblage (16), et l’autre extrémité de l’élément en porte-à-faux (17) est placée en regard de la deuxième couche isolante (13) et séparée de celle-ci par un espace. Une feuille thermoplastique (19) est placée sur le substrat supérieur (15) de façon à recouvrir un trou traversant (18), et la feuille thermoplastique (19) est comprimée sur l’élément en porte-à-faux (17) par une broche chauffée (20) qui la déforme, en réalisant ainsi la fermeture d’un commutateur (10) tout en maintenant la connexion entre l’élément en porte-à-faux (17) et la deuxième couche de câblage (13).
(JA)
 上部基板15の下面の絶縁膜14に第1の配線層16を設け、第1の配線層16に立体的に交差する第2の配線層13を下部基板11上の絶縁膜12上に設け、第1の配線層16にカンチレバー17の一端を接続し、カンチレバー17の他端を第2の配線層13に間隔を隔てて対面させる。上部基板15上には、貫通穴18を覆うように熱可塑性シート19を配置し、熱可塑性シート19を加熱したピン20でカンチレバー17に押圧することで変形させてカンチレバー17の第2の配線層13への接続状態を維持させてスイッチ10を閉じる。
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