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1. WO2006100932 - TAKE UP DEVICE AND TAKE UP METHOD

Publication Number WO/2006/100932
Publication Date 28.09.2006
International Application No. PCT/JP2006/304692
International Filing Date 10.03.2006
IPC
B65H 37/04 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
37Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
04for securing together articles or webs, e.g. by adhesive, stitching, or stapling
B65H 39/16 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
39Associating, collating, or gathering articles or webs
16Associating two or more webs
B65H 41/00 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
41Machines for separating superposed webs
H01L 21/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
CPC
B65H 37/002
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
37Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
002Web delivery apparatus, the web serving as support for articles, material or another web
B65H 41/00
BPERFORMING OPERATIONS; TRANSPORTING
65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
41Machines for separating superposed webs
Applicants
  • リンテック株式会社 LINTEC Corporation [JP]/[JP] (AllExceptUS)
  • 小林 賢治 KOBAYASHI, Kenji [JP]/[JP] (UsOnly)
  • 中田 幹 NAKADA, Kan [JP]/[JP] (UsOnly)
  • 野中 英明 NONAKA, Hideaki [JP]/[JP] (UsOnly)
  • 杉下 芳昭 SUGISHITA, Yoshiaki [JP]/[JP] (UsOnly)
Inventors
  • 小林 賢治 KOBAYASHI, Kenji
  • 中田 幹 NAKADA, Kan
  • 野中 英明 NONAKA, Hideaki
  • 杉下 芳昭 SUGISHITA, Yoshiaki
Agents
  • 和田 成則 WADA, Shigenori
Priority Data
2005-08546124.03.2005JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) TAKE UP DEVICE AND TAKE UP METHOD
(FR) DISPOSITIF ET PROCEDE D’ENROULAGE
(JA) 巻取装置、および巻取方法
Abstract
(EN)
[PROBLEMS] To provide a film take up device and a film take up method by which a film, which is cut to have a prescribed shape and has a narrow end section, can be smoothly taken up without wrinkles, and which are suitable for excellently adhering a film, such as a protection tape to be adhered on a semiconductor wafer, on a body whereupon the film is to be adhered, without wasting the film. [MEANS FOR SOLVING PROBLEMS] A detouring means is provided for temporarily separating an original film (A) wherein a strip-shaped film (A2) is temporarily adhered on a strip-shaped peeling sheet (A1) into the peeling sheet (A1) and the film (A2), and for bonding them again. The film (A2) separated by the detouring means is adhered on a body (B) whereupon the film is to be adhered, and a prescribed shape is cut out from the adhered film (A2). Then, prior to taking up the cut out film (A2) and the peeling sheet (A1) at the same time, the peeling sheet (A1) peeled by the detouring means is adhered so as to cover the cut out hole of the film (A2).
(FR)
Le problème à résoudre dans le cadre de l'invention est de fournir un dispositif et un procédé d’enroulage de film découpé de sorte à prendre une forme déterminée et ayant une section terminale étroite. Ce film peut être enroulé en douceur sans plis. Ce dispositif est excellent pour coller un film, tel qu'une bande de protection à coller sur une tranche semi-conductrice ou sur un corps, sans gaspiller de film. La solution proposée consiste à fournir un moyen de détournement pour séparer temporairement un film initial (A) dans lequel un film en forme de bande (A2) est temporairement collé sur une feuille détachable en forme de bande (A1), en la feuille détachable (A1) et le film (A2) et pour les réunir de nouveau. Le film (A2) séparé par le moyen de détournement est collé sur un corps (B) sur lequel le film doit adhérer, et on découpe une forme déterminée dans le film ayant adhéré (A2). Ensuite, avant de prendre simultanément le film découpé (A2) et la feuille détachable (A1), la feuille détachable (A1) détachée par le moyen de détournement est collée de sorte à recouvrir l’espace découpé dans le film (A2).
(JA)
【課題】所定形状に切断され、縁部が細くなったフイルムを皺なく、きれいに巻き取ることができ、半導体ウエハに貼り付けられる保護テープのようなフイルムを被着体に無駄なく良好に貼り付けるのに好適なフイルムの巻取装置、巻取方法を提供する。 【解決手段】帯状の剥離シートA1に帯状のフイルムA2が仮着された原反Aを剥離シートA1とフイルムA2とに一旦剥離し、それらを再接合する迂回手段が設けられ、該迂回手段で剥離した上記フイルムA2を被着体Bに貼り付け、この貼り付けたフイルムA2を所定形状に切り抜いた後、その切り抜かれたフイルムA2と上記剥離シートA1とを同時に巻き取る前に該フイルムA2の切り抜き穴を塞ぐように、上記迂回手段で剥離した上記剥離シートA1が貼り付けられるものとする。
Also published as
EP6715512
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