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1. WO2006100690 - SELECTIVELY GROOVED COLD PLATE FOR ELECTRONICS COOLING

Publication Number WO/2006/100690
Publication Date 28.09.2006
International Application No. PCT/IN2005/000267
International Filing Date 10.08.2005
Chapter 2 Demand Filed 17.10.2006
IPC
H01L 23/46 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
H01L 23/473 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
473by flowing liquids
H05K 7/20 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
H01L 23/473
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
473by flowing liquids
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 7/20218
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20218using a liquid coolant without phase change in electronic enclosures
H05K 7/20509
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
2039characterised by the heat transfer by conduction from the heat generating element to a dissipating body
20509Cold plates, e.g. multi-component heat spreader, support plates, non closed structures
Applicants
  • BHARAT HEAVY ELECTRICALS LIMITED. [IN]/[IN] (AllExceptUS)
  • SUNDARARAJAN, Nagapatnam [IN]/[IN] (UsOnly)
  • REDDY, Konala, Lakshmana [IN]/[IN] (UsOnly)
  • RAO, Upperla, Narasimha [IN]/[IN] (UsOnly)
  • VEERAMANI, Shanmugan [IN]/[IN] (UsOnly)
Inventors
  • SUNDARARAJAN, Nagapatnam
  • REDDY, Konala, Lakshmana
  • RAO, Upperla, Narasimha
  • VEERAMANI, Shanmugan
Agents
  • DAVAR, G., S.
Priority Data
199/Kol/0522.03.2005IN
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) SELECTIVELY GROOVED COLD PLATE FOR ELECTRONICS COOLING
(FR) PLAQUE FROIDE SELECTIVEMENT RAINUREE DESTINEE AU REFROIDISSEMENT DE COMPOSANTS ELECTRONIQUES
Abstract
(EN)
An improved heat exchange device adaptable for cooling electronic components mounted over at least one external surface of the device, comprising a base plate (1); a cover plate (3) ; a clad sheet (2) interposed between the base plate (1) and the cover plate (3) the base plate (1) and the cover plate (3), with the clad sheet (2) being rigidly jointed to form a single integrated plate; at least one inlet port (5) and at least one outlet port (6) at one end and/or at the opposite ends of the formed plate for entry and exit of a cooling medium, characterized in that the base plate (1) is configured to have a plurality of flow-passages each comprising several machined grooves (4) having varied dimensions predetermined in registration with respective thermal footprint of the electronic components thereby optimizing the heat transfer rate, and in that a plurality of interconnections being designed between the grooves (4) constituting one of a series and parallel flow-paths .
(FR)
L'invention concerne un dispositif d'échange thermique amélioré, adaptable pour refroidir des composants électroniques montés sur au moins une surface extérieure du dispositif. Le dispositif comprend: une plaque de base (1); une plaque de recouvrement (3); une tôle plaquée (2) disposée entre la plaque de base (1) et la plaque de recouvrement (3), ladite tôle plaquée (2) étant solidarisée de façon rigide pour former une seule plaque intégrée; au moins un orifice d'entrée (5) et au moins un orifice de sortie (6) situés à une extrémité et/ou aux extrémités opposées de la plaque formée, lesdits orifices servant à recevoir ou à évacuer un fluide de refroidissement. Le dispositif se caractérise en ce que la plaque de base (1) est configurée pour comprendre une pluralité de circuits d'écoulement qui comprennent plusieurs rainures usinées (4) présentant diverses dimensions préétablies et sont alignés sur un encombrement thermique respectif des composants électroniques, ce qui optimise le taux de transfert de chaleur. Le dispositif se caractérise en outre en ce que plusieurs interconnections sont conçues entre les rainures (4), constituant ainsi un parmi une série de circuits d'écoulement parallèles.
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