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1. WO2006099582 - MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS

Publication Number WO/2006/099582
Publication Date 21.09.2006
International Application No. PCT/US2006/009778
International Filing Date 15.03.2006
IPC
H05K 3/32 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
CPC
B23K 2101/32
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
32Wires
B23K 3/0653
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
3Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
06Solder feeding devices; Solder melting pans
0646Solder baths
0653with wave generating means, e.g. nozzles, jets, fountains
H01R 4/023
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
4Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
02Soldered or welded connections
023between cables or wires and terminals
H01R 43/0242
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02for soldered or welded connections
0242comprising means for controlling the temperature, e.g. making use of the curie point
H01R 43/0256
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
43Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
02for soldered or welded connections
0256for soldering or welding connectors to a printed circuit board
H05K 1/0212
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
0212Printed circuits or mounted components having integral heating means
Applicants
  • MEDCONX, INC. [US]/[US] (AllExceptUS)
  • KENT, Harold, B. [US]/[US] (UsOnly)
  • LEVANTE, James, J. [US]/[US] (UsOnly)
  • FINE, Aaron, T. [US]/[US] (UsOnly)
  • LAYTON, Joseph, R. [US]/[US] (UsOnly)
  • FOX, Sarah [US]/[US] (UsOnly)
Inventors
  • KENT, Harold, B.
  • LEVANTE, James, J.
  • FINE, Aaron, T.
  • LAYTON, Joseph, R.
  • FOX, Sarah
Agents
  • PETERSON, James, W.
Priority Data
60/662,45315.03.2005US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) MINI WAVE SOLDERING SYSTEM AND METHOD FOR SOLDERING WIRES AND PIN CONFIGURATIONS
(FR) SYSTEME DE SOUDAGE PAR MINI-ONDES ET PROCEDE POUR LE SOUDAGE DE FILS ET DE CONFIGURATIONS DE BROCHES
Abstract
(EN)
A mini wave solder system includes a dielectric substrate having a hole defined therethrough, a conductive heat transfer pad, and a conductive retention pad. The heat transfer pad and retention pad are disposed adjacent to the hole and the retention pad has a thermally activated conductive material positioned thereon. The heat transfer pad, retention pad, and hole are in thermal communication with each other. A method for coupling a component to a substrate utilizing this system is also described. A wire termination system includes a dielectric substrate having a surface, a conductive material disposed on the surface of the dielectric substrate comprising a retention pad and a heat transfer pad in thermal communication with each other, and a thermally activated conductive material positioned on the retention pad. When heat is applied to the heat transfer pad, thermal energy travels to the retention pad to melt the thermally activated conductive material.
(FR)
La présente invention a trait à un système de soudage par mini-ondes comportant un substrat diélectrique comprenant un orifice qui est défini à travers celui-ci, un plot de transfert thermique, et un plot de rétention conducteur. Un matériau conducteur est associé à l'orifice. Le plot de transfert thermique et le plot de rétention sont disposés adjacents à l'orifice et le plot de rétention est surmonté d'un matériau conducteur d'activation thermique. Le plot de transfert thermique, le plot de rétention, et l'orifice sont en communication thermique mutuelle. L'invention a également trait à un procédé pour le couplage d'un composant au substrat utilisant le système de l'invention. Un système à terminaison de fils comporte un substrat diélectrique présentant une surface, un matériau conducteur disposé à la surface du substrat diélectrique comportant un plot de rétention et un plot de transfert thermique en communication mutuelle, et un matériau conducteur d'activation thermique positionné sur le plot de rétention. Lors de l'application de la chaleur au plot de transfert thermique, l'énergie thermique se déplace vers le plot de rétention pour la fusion du matériau conducteur d'activation thermique en vue de solidariser un composant au matériau conducteur. L'invention a également trait à un procédé pour le couplage d'un composant à un substrat diélectrique avec un système de terminaison de l'invention. L'invention a également trait à un système de connexion de broche pour le couplage d'une broche à un substrat diélectrique. Le système de connexion de broche comporte un substrat diélectrique comprenant un orifice et des tracés électriques définis à la surface du substrat, une broche positionnée dans l'orifice, et une soudure de raccordement disposée à la surface supérieure de la broche. La broche comporte au moins un saillie radiale disposée sur sa périphérie extérieure pour l'alignement perpendiculaire de la broche avec le substrat et pour la retenue de la broche dans le substrat de manière sensiblement immobile. La soudure de raccordement consolide au moins le raccordement mécanique de la broche au substrat et assure la connexion électrique de la broche aux tracés sur le substrat.
Also published as
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