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1. WO2006098406 - METHOD FOR MANUFACTURING CIRCUIT FORMING BOARD

Publication Number WO/2006/098406
Publication Date 21.09.2006
International Application No. PCT/JP2006/305252
International Filing Date 16.03.2006
Chapter 2 Demand Filed 27.12.2006
IPC
H05K 3/46 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 2201/10378
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
10Details of components or other objects attached to or integrated in a printed circuit board
10227Other objects, e.g. metallic pieces
10378Interposers
H05K 2203/0169
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
01Tools for processing; Objects used during processing
0147Carriers and holders
0169Using a temporary frame during processing
H05K 3/0052
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
0011Working of insulating substrates or insulating layers
0044Mechanical working of the substrate, e.g. drilling or punching
0052Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
H05K 3/4069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
4053by thick-film techniques
4069for via connections in organic insulating substrates
H05K 3/462
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
4614the electrical connections between the circuit boards being made during lamination
462characterized by laminating only or mainly similar double-sided circuit boards
H05K 3/4623
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
4623the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards
Applicants
  • 松下電器産業株式会社 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. [JP]/[JP] (AllExceptUS)
  • 西井 利浩 NISHII, Toshihiro (UsOnly)
Inventors
  • 西井 利浩 NISHII, Toshihiro
Agents
  • 岩橋 文雄 IWAHASHI, Fumio
Priority Data
2005-07681517.03.2005JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR MANUFACTURING CIRCUIT FORMING BOARD
(FR) PROCÉDÉ POUR FABRIQUER UNE CARTE DE FORMATION DE CIRCUIT
(JA) 回路形成基板の製造方法
Abstract
(EN)
A stable and high quality circuit forming board is provided even when a work size is increased. Prepreg sheets (2L1, 2L2), which are board material for stage (B), are arranged on a first metal foil (6L) in a stacking process, and are stacked on the first metal foil (6L). A board material (1) for a stage (C) is stacked on the board material (2L1, 2L2). Two or more prepreg sheets (2U1, 2U2), which are the board material for the stage (B), are stacked on the board material (1), and a second metal foil (6U) is stacked thereon.
(FR)
Carte de formation de circuit de qualité stable et élevée même lorsqu’une taille de travail est augmentée. Des feuilles préimprégnées (2L1, 2L2), qui sont un matériau de carte pour le stade (B), sont agencées sur une première feuille de métal (6L) dans un processus d’empilage, et sont empilées sur la première feuille de métal (6L). Un matériau de carte (1) pour le stade (C) est empilé sur le matériau de carte (2L1, 2L2). Deux feuilles préimprégnées ou plus (2U1, 2U2), qui sont le matériau de carte pour le stade (B), sont empilées sur le matériau de carte (1), et une seconde feuille de métal (6U) est empilée sur celles-ci.
(JA)
 回路形成基板においてワークサイズを大きくしても安定かつ高品質な回路形成基板を提供する。積層工程において第1の金属箔(6L)に対してBステージの基板材料であるプリプレグ(2L1),(2L2)を並べて配設し、第1の金属箔(6L)の上に積層する。基板材料(2L1),(2L2)の上にCステージの基板材料(1)を積層する。基板材料(1)の上に2枚以上のBステージの基板材料であるプリプレグ(2U1),(2U2)を積層し、その上に第2の金属箔(6U)を積層する。
Also published as
EP6729245
Latest bibliographic data on file with the International Bureau