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1. WO2006098233 - ELECTRONIC COMPONENT PACKAGE, COVER BODY FOR SUCH ELECTRONIC COMPONENT PACKAGE, COVER MATERIAL FOR SUCH COVER BODY AND METHOD FOR MANUFACTURING SUCH COVER MATERIAL

Publication Number WO/2006/098233
Publication Date 21.09.2006
International Application No. PCT/JP2006/304720
International Filing Date 10.03.2006
IPC
H01L 23/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
CPC
H01L 23/04
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
02Containers; Seals
04characterised by the shape ; of the container or parts, e.g. caps, walls
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/01079
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01079Gold [Au]
Applicants
  • 株式会社NEOMAXマテリアル NEOMAX MATERIALS CO., LTD. [JP]/[JP] (AllExceptUS)
  • 塩見 和弘 SHIOMI, Kazuhiro [JP]/[JP] (UsOnly)
  • 石尾 雅昭 ISHIO, Masaaki [JP]/[JP] (UsOnly)
Inventors
  • 塩見 和弘 SHIOMI, Kazuhiro
  • 石尾 雅昭 ISHIO, Masaaki
Agents
  • 本田 龍雄 HONDA, Tatsuo
Priority Data
2005-07026814.03.2005JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC COMPONENT PACKAGE, COVER BODY FOR SUCH ELECTRONIC COMPONENT PACKAGE, COVER MATERIAL FOR SUCH COVER BODY AND METHOD FOR MANUFACTURING SUCH COVER MATERIAL
(FR) BOITIER DE COMPOSANT ELECTRONIQUE, CORPS DE REVETEMENT DE CE BOITIER, MATERIAU DE CE CORPS ET PROCEDE DE FABRICATION DE CE MATERIAU
(JA) 電子部品用パッケージ、その蓋体、その蓋体用の蓋材及びその蓋材の製造方法
Abstract
(EN)
A cover body for an electronic component package is provided with a base material layer (2) formed of a low thermal expansion metal; an intermediate metal layer (3), which is stacked on one surface of the base material layer (2) and is formed of a Cu-Ni alloy containing a Ni of 0.5-6.0 mass% or a Cu-Ag alloy containing a Ag of 0.05-10 mass%; and a solder material layer (4) stacked on the intermediate metal layer (3) and is formed of an alloy having silver as a main ingredient. By using such cover body, warp is not easily generated even when degassing process or the like is performed for heating and removing water prior to soldering the cover body to a case, and the case is not easily broken while soldering is performed.
(FR)
La présente invention concerne un corps de revêtement d'un boîtier de composant électronique qui comprend une couche de matériau de base (2) en métal à faible dilatation thermique, une couche de métal intermédiaire (3), qui est superposée sur une surface de la couche de matériau de base (2) et consiste en un alliage Cu-Ni contenant un pourcentage en masse de 0,5 à 6,0 % de nickel ou un alliage Cu-Ag contenant un pourcentage en masse de 0,05 à 10 % d'argent et une couche de matériau de brasage (4) superposée sur la couche de métal intermédiaire (3) et consistant en un alliage composé principalement d'argent. L'utilisation d'un tel corps de revêtement permet d'éviter le gauchissement même en cas de dégazage ou processus similaire réalisé à des fins de chauffage et d'élimination de l'eau avant la soudure du corps à un boîtier, ce dernier offrant une bonne résistance lors de la soudure.
(JA)
not available
Also published as
EP6728888
Latest bibliographic data on file with the International Bureau