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1. WO2006096631 - METHOD FOR CONNECTING FLEXIBLE PRINTED CIRCUIT BOARD TO ANOTHER CIRCUIT BOARD

Publication Number WO/2006/096631
Publication Date 14.09.2006
International Application No. PCT/US2006/007903
International Filing Date 07.03.2006
IPC
H01R 12/08 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
02Structural associations of a plurality of mutually-insulated electrical connecting elements
08specially adapted for flexible printed circuits or flat or ribbon cables
H01R 12/24 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards (PCBs), flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
14Coupling devices
24specially adapted for flexible printed circuits or flat or ribbon cables
CPC
H01R 12/61
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
50Fixed connections
59for flexible printed circuits, flat or ribbon cables or like structures
61connecting to flexible printed circuits, flat or ribbon cables or like structures
H01R 12/62
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
50Fixed connections
59for flexible printed circuits, flat or ribbon cables or like structures
62connecting to rigid printed circuits or like structures
H05K 1/111
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
11Printed elements for providing electric connections to or between printed circuits
111Pads for surface mounting, e.g. lay-out
H05K 2201/09381
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09372Pads and lands
09381Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
H05K 2201/09427
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09372Pads and lands
09427Special relation between the location or dimension of a pad or land and the location or dimension of a terminal
H05K 2201/09727
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
09727Varying width along a single conductor; Conductors or pads having different widths
Applicants
  • 3M INNOVATIVE PROPERTIES COMPANY [US]/[US] (AllExceptUS)
  • KAWATE, Kohichiro [JP]/[JP] (UsOnly)
  • SATO, Yoshiaki [JP]/[JP] (UsOnly)
  • HIRASAWA, Yuji [JP]/[JP] (UsOnly)
Inventors
  • KAWATE, Kohichiro
  • SATO, Yoshiaki
  • HIRASAWA, Yuji
Agents
  • GOVER, Melanie, G.
Priority Data
2005-06185807.03.2005JP
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR CONNECTING FLEXIBLE PRINTED CIRCUIT BOARD TO ANOTHER CIRCUIT BOARD
(FR) PROCEDE PERMETTANT DE RACCORDER UNE CARTE DE CIRCUITS IMPRIMES SOUPLE A UNE AUTRE CARTE DE CIRCUITS IMPRIMES
Abstract
(EN)
A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L)/conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa.s at 200°C.
(FR)
La présente invention concerne un procédé permettant de raccorder une FPC à une seconde carte de circuits imprimés. Le procédé décrit dans cette invention comprend les étapes qui consistent (i) à préparer une carte de circuits imprimés souple (FPC) et une seconde carte de circuit imprimés, (ii) à disposer les éléments de raccord de la FPC en face des éléments de raccord de la seconde carte de circuits imprimés, de telle sorte qu'un film adhésif thermodurcissable est placé entre les éléments de raccord de la FPC et les éléments de raccord de la seconde carte de circuits imprimés, et (iii) à appliquer une pression et une chaleur suffisamment élevées pour éliminer parfaitement le film adhésif afin d'établir un contact électrique et permettre le durcissement de l'adhésif. Le rapport de la largeur du conducteur (L) sur la distance entre les conducteurs (S) dans les éléments d'extrémité du câblage conducteur constituant les éléments de raccord de la FPC est égal ou inférieur à 0,5 et le film adhésif thermodurcissable est réglé pour présenter une viscosité comprise entre 500 et 20 000 Pa.s à 200°C.
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