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1. WO2006095676 - OPTICAL COMMUNICATION MODULE AND MANUFACTURING METHOD THEREOF

Publication Number WO/2006/095676
Publication Date 14.09.2006
International Application No. PCT/JP2006/304249
International Filing Date 06.03.2006
IPC
H01L 33/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 31/02 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength, or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
CPC
G02B 6/4204
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4204the coupling comprising intermediate optical elements, e.g. lenses, holograms
G02B 6/4246
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4246Bidirectionally operating package structures
G02B 6/4272
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4266Thermal aspects, temperature control or temperature monitoring
4268Cooling
4272with mounting substrates of high thermal conductivity
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/48465
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
48463the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
48465the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Applicants
  • ローム株式会社 Rohm Co., Ltd. [JP]/[JP] (AllExceptUS)
  • 堀尾 友春 HORIO, Tomoharu [JP]/[JP] (UsOnly)
  • 田沼 裕輝 TANUMA, Yuki [JP]/[JP] (UsOnly)
  • 中村 聡 NAKAMURA, Satoshi [JP]/[JP] (UsOnly)
  • 森本和巳 MORIMOTO, Kazumi [JP]/[JP] (UsOnly)
Inventors
  • 堀尾 友春 HORIO, Tomoharu
  • 田沼 裕輝 TANUMA, Yuki
  • 中村 聡 NAKAMURA, Satoshi
  • 森本和巳 MORIMOTO, Kazumi
Agents
  • 吉田 稔 YOSHIDA, Minoru
Priority Data
2005-06178107.03.2005JP
2005-07499616.03.2005JP
2005-21411525.07.2005JP
2005-21527026.07.2005JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) OPTICAL COMMUNICATION MODULE AND MANUFACTURING METHOD THEREOF
(FR) MODULE DE COMMUNICATION OPTIQUE ET PROCEDE DE FABRICATION
(JA) 光通信モジュールおよびその製造方法
Abstract
(EN)
An infrared data communication module (A1) includes: a substrate (1) having a first layer (1A) where an indentation (11) opening toward the surface is formed and the opening of the indentation (11) is provided and a second layer (1B) layered at the side opposite to the opening with respect to the first layer (1A); a bonding conductor layer (6A) formed so as to cover at least the bottom of the indentation (11); a light emitting element (2) mounted on the bonding conductor layer (6A); and a radiation conductor layer (6C) sandwiched between the first layer (1A) and the second layer (1B) and connected to the bonding conductor layer (6A).
(FR)
L'invention concerne un module de communication de données par infrarouge (A1) qui inclut (i) un substrat (1) comportant une première couche (1A) dans laquelle est formée un enfoncement (11) s'ouvrant vers la surface, l'ouverture de l’enfoncement (11) étant fournie, et une seconde couche (1B) appliquée sur le côté opposé à l'ouverture par rapport à la première couche (1A) ; une couche de jonction conductrice (6A) formée de manière à couvrir au moins le fond de l'enfoncement (11) ; un élément émetteur de lumière (2) monté sur la couche de jonction conductrice (6A) ; et une couche conductrice de radiations (6C) sandwich entre la première couche (1A) et la seconde couche (1B) et connectée à la couche de jonction conductrice (6A).
(JA)
 赤外線データ通信モジュール(A1)は、表面に開口する凹部(11)が形成されており、凹部(11)の開口部を有する第1層(1A)と、第1層(1A)に対して上記開口部とは反対側に積層された第2層(1B)とを含む基板(1)と、少なくとも凹部(11)の底面を覆うように形成されたボンディング用導体層(6A)と、ボンディング用導体層(6A)上に搭載された発光素子(2)と、第1層(1A)および第2層(1B)に挟まれており、かつボンディング用導体層(6A)と繋がる放熱用導体層(6C)と、を備える。
Also published as
EP6728668
Latest bibliographic data on file with the International Bureau