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1. WO2006094870 - METHOD AND DEVICE FOR TREATING WAFERS ON ASSEMBLY CARRIERS

Publication Number WO/2006/094870
Publication Date 14.09.2006
International Application No. PCT/EP2006/050783
International Filing Date 08.02.2006
IPC
H01L 21/687 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
CPC
B24B 37/30
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
27Work carriers
30for single side lapping of plane surfaces
B24B 41/068
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
41Component parts such as frames, beds, carriages, headstocks
06Work supports, e.g. adjustable steadies
068Table-like supports for panels, sheets or the like
H01L 21/68757
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68757characterised by a coating or a hardness or a material
Applicants
  • INFINEON TECHNOLOGIES AG [DE]/[DE] (AllExceptUS)
  • KRÖNINGER, Werner [DE]/[DE] (UsOnly)
  • SCHNEEGANS, Manfred [DE]/[DE] (UsOnly)
Inventors
  • KRÖNINGER, Werner
  • SCHNEEGANS, Manfred
Agents
  • KINDERMANN, Peter
Priority Data
102005011107.610.03.2005DE
Publication Language German (DE)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN UND VORRICHTUNG ZUM BEARBEITEN VON WAFERN AUF MONTAGETRÄGERN
(EN) METHOD AND DEVICE FOR TREATING WAFERS ON ASSEMBLY CARRIERS
(FR) PROCEDE ET DISPOSITIF POUR TRAITER DES PLAQUETTES SUR DES SUPPORTS DE MONTAGE
Abstract
(DE)
Verfahren und Vorrichtung zum Bearbeiten von Wafern auf Montageträgern Die Erfindung betrifft ein Verfahren und eine Vorrichtung zum Bearbeiten von Wafern (3) auf Montageträgern (1) bei dem der zu bearbeitende Wafer (3) durch Vereisung eines Flüssigkeitsfilras (6), welcher sich zwischen der Vorderseite des Wafers (3) und dem Montageträger (1) befindet, auf diesem fixiert wird.
(EN)
The invention relates to a method and a device for treating wafers (3) on assembly carriers (1). According to the invention, the wafer (3) to be treated can be fixed to the assembly carrier by freezing a liquid film (6) located between the front side of the wafer (3) and the assembly carrier (1).
(FR)
L'invention concerne un procédé et un dispositif pour traiter des plaquettes sur des supports de montage. L'invention concerne un procédé et un dispositif pour traiter lesdites plaquettes (3) sur des supports de montage (1), selon lesquels la plaquette (3) à traiter peut être fixée sur le support de montage par givrage d'une pellicule de liquides (6), laquelle se situe entre la partie avant de la plaquette (3) et le support de montage (1).
Also published as
EP6708127
US11852885
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