WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2006091603) SELF-CONTAINED COOLING MECHANISM FOR INTEGRATED CIRCUIT USING A REVERSIBLE ENDOTHERMIC CHEMICAL REACTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/091603    International Application No.:    PCT/US2006/006126
Publication Date: 31.08.2006 International Filing Date: 21.02.2006
IPC:
H02H 1/00 (2006.01)
Applicants: MAYO FOUNDATION FOR MEDICAL EDUCATION AND RESEARCH [US/US]; 200 First Street SE, Rochester, MN 55905 (US) (For All Designated States Except US).
WILKINS, Wendy, L. [US/US]; (US) (For US Only).
GILBERT, Barry, K. [US/US]; (US) (For US Only)
Inventors: WILKINS, Wendy, L.; (US).
GILBERT, Barry, K.; (US)
Agent: WESTLAKE, Jeremy, J.; Quarles & Brady LLP, 411 East Wisconsin Avenue, Milwaukee, WI 53202 (US)
Priority Data:
60/655,558 23.02.2005 US
Title (EN) SELF-CONTAINED COOLING MECHANISM FOR INTEGRATED CIRCUIT USING A REVERSIBLE ENDOTHERMIC CHEMICAL REACTION
(FR) MECANISME DE REFROIDISSEMENT AUTOPORTEUR DESTINE A UN CIRCUIT INTEGRE QUI UTILISE UNE REACTION CHIMIQUE ENDOTHERMIQUE REVERSIBLE
Abstract: front page image
(EN)A package for a semiconductor chip or other heat producing device has a supporting substrate to which the devices mount and electrically connect. An enclosure is formed over the heat producing devices and filled with a working fluid including a chemical compound that reacts endothermically to absorb heat produced by the devices and releases the heat in a reverse reaction to the enclosure.
(FR)Un boîtier d'une puce semi-conductrice ou d'un autre dispositif dégageant la chaleur comprend un substrat de support sur lequel sont montés des dispositifs et auxquels ils sont connectés électriquement. Une enceinte est formée par-dessus les dispositifs dégageant la chaleur; elle est remplie avec un fluide de travail qui comprend un composé chimique qui réagit de façon endothermique et absorbe la chaleur dégagée par les dispositifs; elle dégage la chaleur lors d'une réaction inverse à celle qui a lieu dans l'enceinte.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)