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1. (WO2006090682) MACHINING METHOD OF MICROSTRUCTURE AND MACHINING SYSTEM OF MICROSTRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/090682    International Application No.:    PCT/JP2006/303016
Publication Date: 31.08.2006 International Filing Date: 21.02.2006
IPC:
B29C 59/02 (2006.01), B29C 43/32 (2006.01), B29C 43/36 (2006.01), B29C 43/52 (2006.01), B81C 99/00 (2010.01), B82B 3/00 (2006.01), H01L 21/027 (2006.01)
Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD. [JP/JP]; 5-33, Kitahama 4-chome, Chuo-ku, Osaka-shi, Osaka 5410041 (JP) (For All Designated States Except US).
YORITA, Jun [JP/JP]; (JP) (For US Only).
MIKAGE, Katsunari [JP/JP]; (JP) (For US Only)
Inventors: YORITA, Jun; (JP).
MIKAGE, Katsunari; (JP)
Agent: FUKAMI, Hisao; Fukami Patent Office, Nakanoshima Central Tower, 22nd Floor, 2-7, Nakanoshima 2-chome, Kita-ku, Osaka-shi, Osaka 5300005 (JP)
Priority Data:
2005-050829 25.02.2005 JP
2005-132561 28.04.2005 JP
Title (EN) MACHINING METHOD OF MICROSTRUCTURE AND MACHINING SYSTEM OF MICROSTRUCTURE
(FR) PROCEDE ET SYSTEME D’USINAGE DE MICROSTRUCTURE
(JA) 微細構造体の加工方法および微細構造体の加工装置
Abstract: front page image
(EN)A machining method of microstructure in which an opposed-surface plate (211) is moved from a retreat position to a forming position and a film (1) is pressed against a die (5) and machined. Subsequently, a second block (211b) is separated from a first block (211a). Consequently, the total thermal capacity of the opposed-surface plate (211) is reduced by reducing the volume of the opposed-surface plate (211) at the time of cooling and cooling rate of the opposed-surface plate (211) can be enhanced by physically discharging heat stored in the opposed-surface plate (211). The cooling efficiency of the opposed-surface plate (211) is thereby enhanced and the heat cycle thereof can be shortened.
(FR)La présente invention décrit un procédé d’usinage de microstructure dans lequel une plaque de surface opposée (211) est déplacée d’une position de retrait à une position de formation et un film (1) est pressé contre une matrice (5) et usiné. Ensuite, un second bloc (211b) est séparé d’un premier bloc (211a). Par conséquent, la capacité thermique totale de la plaque de surface opposée (211) est réduite en réduisant le volume de la plaque de surface opposée (211) au moment du refroidissement et le taux de refroidissement de la plaque de surface opposée (211) peut être amélioré en déchargeant physiquement la chaleur stockée dans la plaque de surface opposée (211). L’efficacité de refroidissement de la plaque de surface opposée (211) est de ce fait améliorée et ainsi il est possible d ‘en réduire le cycle thermique.
(JA) 本発明の微細構造体の加工方法においては、対向定盤(211)を退避位置から成型加工位置に移動させて、フィルム(1)が型(5)に押し当てられ、加工される。その後、第2ブロック(211b)が、第1ブロック(211a)から離される。これにより、冷却時における対向定盤(211)の体積を減らして対向定盤(211)の総熱容量を減少させ、対向定盤(211)に蓄えられた熱量を物理的に排出することで、対向定盤(211)の冷却速度の向上を図ることを可能としている。これにより、対向定盤(211)の冷却効率の向上が図られ、対向定盤(211)のヒートサイクルの短縮化を図ることが可能となる。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)