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Machine translation
1. (WO2006090497) POLISHING APPARATUS AND POLISHING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/090497    International Application No.:    PCT/JP2005/016195
Publication Date: 31.08.2006 International Filing Date: 30.08.2005
IPC:
B24B 37/04 (2012.01), H01L 21/304 (2006.01)
Applicants: EBARA CORPORATION [JP/JP]; 11-1, Haneda Asahi-cho, Ohta-ku, Tokyo, 1448510 (JP) (For All Designated States Except US).
FUKUDA, Akira [JP/JP]; (JP) (For US Only).
MOCHIZUKI, Yoshihiro [JP/JP]; (JP) (For US Only).
HIROKAWA, Kazuto [JP/JP]; (JP) (For US Only)
Inventors: FUKUDA, Akira; (JP).
MOCHIZUKI, Yoshihiro; (JP).
HIROKAWA, Kazuto; (JP)
Agent: SHAMOTO, ICHIO; YUASA AND HARA, Section 206, New Ohtemachi Bldg., 2-1, Ohtemachi 2-chome, Chiyoda-ku, Tokyo, 1000004 (JP)
Priority Data:
2005-050481 25.02.2005 JP
Title (EN) POLISHING APPARATUS AND POLISHING METHOD
(FR) DISPOSITIF ET PROCEDE DE POLISSAGE
Abstract: front page image
(EN)A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer (W) by applying a pressure between a polishing member (polishing pad) (201) and the wafer (W) held by a holding member (top ring) (52) and relatively moving the polishing member (201) to the wafer (W). The polishing apparatus comprises a top ring (52) for holding the wafer (W), a pressure adjusting mechanism (206) for adjusting a supporting pressure with which the wafer (W) is supported on a supporting surface by a retainer ring (203), and a control unit (208) for controlling the pressure adjusting mechanism (206) to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer (W) .
(FR)L'invention concerne un dispositif de polissage qui permet de polir des plaquettes avec un rendement élevé même en cas de débordement. Le dispositif de polissage poli la plaquette (W) par application de pression entre un élément de polissage (tampon de polissage) et la plaquette (W) maintenue par un élément de retenue (anneau supérieur) (2), et par déplacement relatif de l'élément de polissage (201) sur la plaquette (W). Le dispositif de polissage comprend un anneau supérieur (52) qui permet de retenir la plaquette (W); un mécanisme de réglage de pression (206) qui permet de régler la pression de support sous l'effet de laquelle la plaquette (W) est retenue sur une surface de support à l'aide de l'anneau de retenue (203); et une unité de commande (208) qui permet de gérer le mécanisme de réglage de pression de manière à régler la pression de support à la pression souhaitée sur la base du degré de débordement de la plaquette.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KM, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)