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Machine translation
1. (WO2006087648) LEAD FREE DESOLDERING BRAID
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/087648    International Application No.:    PCT/IB2006/050372
Publication Date: 24.08.2006 International Filing Date: 04.02.2006
IPC:
B23K 1/018 (2006.01), D04C 1/06 (2006.01)
Applicants: ILLINOIS TOOL WORKS INC. [US/US]; Patent Department, 3600 West Lake Avenue, Glenview, Illinois 60026 (US) (For All Designated States Except US).
KLEIN, Gary J. [US/US]; (US) (For US Only).
MAX, Susan D. [US/US]; (US) (For US Only)
Inventors: KLEIN, Gary J.; (US).
MAX, Susan D.; (US)
Agent: BREH, Donald, J.; 3600 West Lake Avenue, Glenview, Illinois 60026 (US)
Priority Data:
11/062,187 18.02.2005 US
Title (EN) LEAD FREE DESOLDERING BRAID
(FR) TRESSE A DESSOUDER SANS PLOMB
Abstract: front page image
(EN)A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183 0C (about 361°F).
(FR)L'invention concerne une tresse destinée à dessouder une carte de circuit imprimé ou un composant électrique comprenant une soudure sans plomb, formée d'une pluralité de fils métalliques solides réunis en un faisceau dans lequel une pluralité de faisceaux sont tressés les uns avec les autres de manière à former une tresse. La tresse est d'une seule épaisseur et est configurée pour dessouder la carte de circuit imprimé ou le compsoant électrique comprenant une soudure sans plomb avec une température de point de fusion dépassant 183°C (environ 361°F).
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)