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Machine translation
1. (WO2006086265) METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/086265    International Application No.:    PCT/US2006/004013
Publication Date: 17.08.2006 International Filing Date: 02.02.2006
IPC:
C09G 1/04 (2006.01), H01L 21/321 (2006.01)
Applicants: APPLIED MATERIALS, INC. [US/US]; 3050 Bowers Avenue, Santa Clara, CA 95054 (US) (For All Designated States Except US).
ZHAO, Junzi [CN/US]; (US) (For US Only).
LIU, Feng, Q. [US/US]; (US) (For US Only).
WANG, You [US/US]; (US) (For US Only).
TSAI, Stan, D. [CA/US]; (US) (For US Only)
Inventors: ZHAO, Junzi; (US).
LIU, Feng, Q.; (US).
WANG, You; (US).
TSAI, Stan, D.; (US)
Agent: PATTERSON, B. Todd; Patterson & Sheridan, L.L.P., 3040 Post Oak Blvd., Suite 1500, Houston, Texas 77056-6582 (US)
Priority Data:
60/650,676 07.02.2005 US
Title (EN) METHOD AND COMPOSITION FOR POLISHING A SUBSTRATE
(FR) PROCEDE ET COMPOSITION DE POLISSAGE DE SUBSTRAT
Abstract: front page image
(EN)Polishing compositions and methods for removing barrier materials from a substrate surface are provided. In one aspect, a composition is provided for removing at least a barrier material from a substrate surface including an acid based electrolyte system, one or more chelating agents, one or more pH adjusting agents to provide a pH between about 3 and about 11, and a solvent. The composition may be used in an electrochemical mechanical planarization process. The polishing compositions and methods described herein improve the effective removal rate of barrier materials from the substrate surface with a reduction in planarization type defects.
(FR)L'invention concerne des compositions de polissage et des procédés d'élimination de matériaux barrières de la surface d'un substrat. Dans un aspect, une composition servant à éliminer au moins un matériau barrière de la surface d'un substrat contient un système électrolytique à base d'acide, au moins un agent chélateur, au moins un agent ajusteur de pH permettant d'obtenir un pH compris entre environ 3 et environ 11, et un solvant. Cette composition peut être utilisée dans un procédé de planarisation mécanique électrochimique. Les compositions de polissage et les procédés selon l'invention permettent d'améliorer la vitesse d'élimination effective de matériaux barrières de la surface d'un substrat, tout en réduisant les défauts de type planarisation.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)