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Machine translation
1. (WO2006085573) INTERPOSER, PROBE CARD AND METHOD FOR MANUFACTURING INTERPOSER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/085573    International Application No.:    PCT/JP2006/302238
Publication Date: 17.08.2006 International Filing Date: 09.02.2006
IPC:
G01R 1/06 (2006.01), G01R 1/073 (2006.01), H01L 21/66 (2006.01)
Applicants: TOKYO ELECTRON LIMITED [JP/JP]; 3-6, Akasaka 5-chome, Minato-ku, Tokyo 1078481 (JP) (For All Designated States Except US).
YAKABE, Masami [JP/JP]; (JP) (For US Only).
HOSHINO, Tomohisa [JP/JP]; (JP) (For US Only)
Inventors: YAKABE, Masami; (JP).
HOSHINO, Tomohisa; (JP)
Agent: ITOH, Hidehiko; IMY INTERNATIONAL PATENT OFFICE Kyowa Shimanouchi Bldg. 21-19, Shimanouchi 1-chome Chuo-ku, Osaka-shi, Osaka 5420082 (JP)
Priority Data:
2005-035043 10.02.2005 JP
Title (EN) INTERPOSER, PROBE CARD AND METHOD FOR MANUFACTURING INTERPOSER
(FR) INTERPOSEUR, CARTE SONDE, ET PROCEDE DE FABRICATION D'INTERPOSEUR
(JA) インターポーザ、プローブカードおよびインターポーザの製造方法
Abstract: front page image
(EN)Disclosed is an interposer comprising a silicon substrate (20). A plurality of conduction holes (27) penetrating the silicon substrate (20) are formed by dry etching, and at least one end of each conduction hole (27) is provided with a probe (12) via a pad (45). Since conduction holes are formed in a substrate which can be processed by dry etching, a plurality of fine conduction holes can be continuously formed and a probe can be connected to each conduction hole. Consequently, there can be obtained an interposer wherein probes are arranged at high density.
(FR)La présente invention concerne un interposeur comprenant un substrat en silicium (20). Une pluralité de trous de conduction (27) pénétrant dans le substrat de silicium est obtenue par gravure à sec, l'une au moins des extrémités de chaque trou de conduction (27) est pourvue d'une sonde (12) via un patin (45). Etant donné que les trous de conduction sont formés dans un substrat qui se prête au traitement par gravure à sec, on peut former en continu une pluralité de trous de conduction, avec la possibilité de raccorder une sonde à chaque trou de conduction. L'invention permet ainsi de réaliser un interposeur à grande densité de sondes.
(JA)not available
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)