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Machine translation
1. (WO2006080301) THREE-DIMENSIONAL WIRING BODY FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING STRUCTURE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/080301    International Application No.:    PCT/JP2006/301032
Publication Date: 03.08.2006 International Filing Date: 24.01.2006
IPC:
H05K 1/02 (2006.01), H05K 1/18 (2006.01), H01B 7/08 (2006.01)
Applicants: THE FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 6-1, Marunouchi 2-chome, Chiyoda-ku Tokyo 1008322 (JP) (For All Designated States Except US).
ENOMOTO, Noritsugu [JP/JP]; (JP) (For US Only).
UTSUNOMIYA, Hirofumi [JP/JP]; (JP) (For US Only).
KAMIMURA, Ken [JP/JP]; (JP) (For US Only).
MOTOMURA, Shigeki [JP/JP]; (JP) (For US Only).
AOYAGI, Shigeharu [JP/JP]; (JP) (For US Only).
TAKEDA, Junichi [JP/JP]; (JP) (For US Only)
Inventors: ENOMOTO, Noritsugu; (JP).
UTSUNOMIYA, Hirofumi; (JP).
KAMIMURA, Ken; (JP).
MOTOMURA, Shigeki; (JP).
AOYAGI, Shigeharu; (JP).
TAKEDA, Junichi; (JP)
Agent: KAWAWA, Takaho; Mita-Maruhachi Bldg. 7F 1-10, Mita 3-chome Minato-ku, Tokyo 108-0073 (JP)
Priority Data:
2005-016379 25.01.2005 JP
Title (EN) THREE-DIMENSIONAL WIRING BODY FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MOUNTING STRUCTURE
(FR) CORPS DE CABLAGE EN TROIS DIMENSIONS ET STRUCTURE DE MONTAGE DE COMPOSANT ELECTRONIQUE
(JA) 電子部品実装配線体および電子部品実装構造体
Abstract: front page image
(EN)A wiring body (10) for mounted with an electronic component comprising a flat wiring body (2) mounted with a large number of electronic components (20) and a plurality of base members (31) to which the flat wiring body (2) is fixed, wherein the flat wiring body (2) has an arranging direction changing bent portion (9) formed by bending the flat wiring body (2) to change the arranging direction of the electronic components (20), and each base member (31) has an arranging direction changing portion (37) to which the arranging direction changing bent portion (9) is secured. Furthermore, an electronic component mounting structure (1) is constituted by assembling the wiring body (10) for mounting an electronic component three-dimensionally using coupling members (32) for coupling the plurality of base members (31).
(FR)L'invention concerne un corps de câblage (10), destiné à être monté avec un composant électronique, comprenant un corps plat de câblage (2) surmonté d'un grand nombre de composants électroniques (20) et une pluralité d'éléments de base (31) sur lesquels est fixé le corps plat de câblage (2), où le corps plat de câblage (2) comporte une partie cintrée de modification de direction d'agencement formée en cintrant le corps plat de câblage (2) afin de modifier la direction d'agencement des composants électroniques (20) et où chaque élément de base (31) comporte une partie de modification de direction d'agencement (37) à laquelle est fixée la partie cintrée de modification de direction d'agencement (9). En outre, une structure de montage de composant électronique (1) est constituée en assemblant le corps de câblage (10) de montage d'un composant électronique en utilisant dans trois dimensions des éléments de liaison (32) destinés à relier la pluralité d'éléments de base (31).
(JA) 電子部品実装配線体10は、多数の電子部品20が実装されたフラット配線体2と、フラット配線体2が取り付けられる複数のベース部材31とを備え、フラット配線体2は、電子部品20の配列方向が変換されるように折り曲げられて形成される配列方向変換折曲部9を有し、ベース部材31は、配列方向変換折曲部9を固定する配列方向変換部37を有する。また、複数のベース部材31間を連結する連結部材32を用いて電子部品実装配線体10を立体形状に組み立てた電子部品実装構造体1が構成される。
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)