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1. WO2006080247 - CONDUCTIVE PASTE

Publication Number WO/2006/080247
Publication Date 03.08.2006
International Application No. PCT/JP2006/300829
International Filing Date 20.01.2006
IPC
H01B 1/22 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/09 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
H01B 1/22
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
22the conductive material comprising metals or alloys
H05K 1/095
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the ; conductive, e.g. ; metallic pattern
092Dispersed materials, e.g. conductive pastes or inks
095for polymer thick films, i.e. having a permanent organic polymeric binder
H05K 3/4069
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
40Forming printed elements for providing electric connections to or between printed circuits
4038Through-connections; Vertical interconnect access [VIA] connections
4053by thick-film techniques
4069for via connections in organic insulating substrates
Applicants
  • 藤倉化成株式会社 FUJIKURA KASEI CO., LTD. [JP]/[JP] (AllExceptUS)
  • 旭化成エレクトロニクス株式会社 Asahi Kasei EMD Corporation [JP]/[JP] (AllExceptUS)
  • 平川 洋平 HIRAKAWA, Yohei [JP]/[JP] (UsOnly)
  • 若林 克知 WAKABAYASHI, Katsutomo [JP]/[JP] (UsOnly)
  • 四ツ▲柳▼ 雄太 YOTSUYANAGI, Yuta [JP]/[JP] (UsOnly)
  • 田中 軌人 TANAKA, Norihito [JP]/[JP] (UsOnly)
Inventors
  • 平川 洋平 HIRAKAWA, Yohei
  • 若林 克知 WAKABAYASHI, Katsutomo
  • 四ツ▲柳▼ 雄太 YOTSUYANAGI, Yuta
  • 田中 軌人 TANAKA, Norihito
Agents
  • 志賀 正武 SHIGA, Masatake
Priority Data
2005-01696525.01.2005JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CONDUCTIVE PASTE
(FR) PATE CONDUCTRICE
(JA) 導電性ペースト
Abstract
(EN)
A conductive paste having an excellent conductivity and an excellent conductive connection reliability contains a binder containing a thermosetting resin, and conductive particles. The lowest heat generation peak temperature T1 (degrees C) among at least one heat generation peak obtained by a differential scanning calorie measurement of the binder and the lowest heat absorption peak temperature t1 (degrees C) among at least one heat absorption peak obtained by the differential scanning calorie measurement of the conductive particles satisfy the following relationship: t1 - 20 < T1 ...(1).
(FR)
La présente invention concerne une pâte conductrice présentant une excellente conductivité et une excellente fiabilité de connexion conductrice qui contient un liant contenant une résine thermodurcissable et des particules conductrices. La température de crête de génération de chaleur la plus basse T1 (degrés C) parmi au moins une crête de génération de chaleur obtenue par une mesure calorimétrique à compensation de puissance du liant et la température de crête d’absorption de chaleur la plus basse t1 (degrés C) parmi au moins une crête d’absorption de chaleur obtenue par une mesure calorimétrique à compensation de puissance des particules conductrices satisfont la relation suivante : t1 - 20 < T1 ... (1).
(JA)
 熱硬化性樹脂を含有するバインダーと、導電性粒子とを含み、前記バインダーの示差走査熱量測定による少なくとも1つの発熱ピークのうち最も低温の発熱ピーク温度T(°C)と、前記導電性粒子の示差走査熱量測定による少なくとも1つの吸熱ピークのうち最も低温の吸熱ピーク温度t(°C)とが、t-20<T・・・(1)の関係を満足する、導電性が良好で、導電接続信頼性にも優れる導電性ペースト。
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