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Machine translation
1. (WO2006079849) IMPROVEMENTS TO CERAMIC PACKAGES FOR HIGH FREQUENCY CIRCUITS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2006/079849    International Application No.:    PCT/GB2006/050015
Publication Date: 03.08.2006 International Filing Date: 23.01.2006
IPC:
H01L 21/50 (2006.01), H01L 23/10 (2006.01), H01L 21/48 (2006.01), H01L 23/13 (2006.01), H01L 23/15 (2006.01)
Applicants: EADS ASTRIUM LIMITED [GB/GB]; Gunnels Wood Road, Stevenage, Hertfordshire SG1 2AS (GB) (For All Designated States Except US).
RUMER, Simon, Leonard [GB/GB]; (GB) (For US Only)
Inventors: RUMER, Simon, Leonard; (GB)
Agent: BAE SYSTEMS PLC; P.O. Box 87, Lancaster House, Farnborough Aerospace Centre, Farnborough, Hampshire GU14 6YU (GB)
Priority Data:
05250485.9 29.01.2005 EP
0501871.8 29.01.2005 GB
Title (EN) IMPROVEMENTS TO CERAMIC PACKAGES FOR HIGH FREQUENCY CIRCUITS
(FR) AMÉLIORATIONS APPORTÉES AUX PAQUETS CÉRAMIQUES POUR CIRCUITS HAUTE FRÉQUENCE
Abstract: front page image
(EN)Projecting elongate stub walls (12) and (13) are provided on the planar surfaces of a ceramic substrate (2) at positions where bonding of the substrate to a clamping lid or base is to be carried out. After firing of the substrate, the surfaces (5) thereof are mechanically processed but since the stub walls (12) and (13) protrude from the substrate, the grinding and polishing tools make contact with the surfaces of these stub walls (12) and (13) , rather than with the entire substrate surface. As a result, the area of the substrate to be processed is minimised and problems with dishing and erosion are alleviated. This allows the clamping (10) lid, or frame (4) to be bonded using conventional conductive adhesive (3) processes, avoiding the cracking and stress problems associated with non- uniformity of the surface of the ceramic substrates .
(FR)Selon l’invention, on dispose des parois tronquées allongées saillantes (12) et (13) sur les surfaces planes d’un substrat céramique (2) en des positions auxquelles on lie le substrat à un socle ou un couvercle de serrage. Après la cuisson du substrat, les surfaces (5) de celui-ci sont traitées mécaniquement, mais dans la mesure où les parois tronquées (12) et (13) font saillie du substrat, les outils de meulage et de polissage font contact avec les surfaces de ces parois tronquées (12) et (13), et non avec la surface du substrat toute entière. Ainsi, la zone du substrat à traiter est minimisée et les problèmes d’emboutissage et d’érosion sont atténués. Ceci permet de lier le couvercle de serrage (10) ou le cadre (4) à l’aide d’un adhésif conducteur conventionnel (3), supprimant les problèmes de fissurage et de contrainte liés à la non-uniformité de la surface des substrats céramiques.
Designated States: AE, AG, AL, AM, AT, AU, AZ, BA, BB, BG, BR, BW, BY, BZ, CA, CH, CN, CO, CR, CU, CZ, DE, DK, DM, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LC, LK, LR, LS, LT, LU, LV, LY, MA, MD, MG, MK, MN, MW, MX, MZ, NA, NG, NI, NO, NZ, OM, PG, PH, PL, PT, RO, RU, SC, SD, SE, SG, SK, SL, SM, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, YU, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HU, IE, IS, IT, LT, LU, LV, MC, NL, PL, PT, RO, SE, SI, SK, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)