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1. WO2006053300 - TRACKING AND MARKING SPECIMENS HAVING DEFECTS

Publication Number WO/2006/053300
Publication Date 18.05.2006
International Application No. PCT/US2005/041218
International Filing Date 14.11.2005
IPC
G06F 19/00 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
FELECTRIC DIGITAL DATA PROCESSING
19Digital computing or data processing equipment or methods, specially adapted for specific applications
CPC
B23K 2101/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
42Printed circuits
B23K 2103/12
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
08Non-ferrous metals or alloys
12Copper or alloys thereof
B23K 2103/172
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
16Composite materials ; , e.g. fibre reinforced
166Multilayered materials
172wherein at least one of the layers is non-metallic
B23K 2103/42
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
30Organic material
42Plastics
B23K 2103/50
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
B23K 26/02
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
Applicants
  • ELECTRO SCIENTIFIC INDUSTRIES, INC. [US]/[US] (AllExceptUS)
  • TYLER, Michael [US]/[US] (UsOnly)
  • COLBY, Robert W. [US]/[US] (UsOnly)
  • LEONARD, Jeffrey W. [US]/[US] (UsOnly)
  • DOTSON, Lindsey M. [US]/[US] (UsOnly)
  • WATT, David A. [US]/[US] (UsOnly)
  • HILL, Cris E. [US]/[US] (UsOnly)
  • CAMPBELL, Laura H. [US]/[US] (UsOnly)
Inventors
  • TYLER, Michael
  • COLBY, Robert W.
  • LEONARD, Jeffrey W.
  • DOTSON, Lindsey M.
  • WATT, David A.
  • HILL, Cris E.
  • CAMPBELL, Laura H.
Agents
  • ANGELLO, Paul S.
Priority Data
60/628,27815.11.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) TRACKING AND MARKING SPECIMENS HAVING DEFECTS
(FR) DETECTION ET MARQUAGE DE SPECIMENS PRESENTANT DES DEFAUTS FORMES PENDANT LE PERÇAGE DE TROUS D'INTERCONNEXION PAR LASER
Abstract
(EN) A method and system (10) increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage (22) in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine (12), which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen.
(FR) L'invention concerne un procédé et un système (10) permettant d'augmenter la production de spécimens (4) traités lors du traitement laser d'un matériau cible (2) comprenant des spécimens multiples formés sur un substrat commun. Les formes de réalisation préférées offrent une fonction qui permet l'enregistrement (22) dans le système de traitement laser d'une liste de spécimens défectueux sur lesquels une quelconque erreur s'est produite pendant le traitement laser. Une fois que le substrat commun a été entièrement traité, le système avertit l'opérateur du nombre de spécimens traités de manière incorrecte et offre à l'opérateur la possibilité d'exécuter une routine logicielle (12) qui, dans un mode de réalisation préféré, consiste à utiliser un laser pour inscrire une marque sur la surface supérieure de chaque spécimen présentant un traitement défectueux.
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