Processing

Please wait...

Settings

Settings

Goto Application

1. WO2006052955 - METHOD OF MANUFACTURING RFID DEVICES USING FLUIDIC SELF ASSEMBLY AND A LOCAL

Publication Number WO/2006/052955
Publication Date 18.05.2006
International Application No. PCT/US2005/040410
International Filing Date 08.11.2005
IPC
H01L 21/98 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
98Assembly of devices consisting of solid state components formed in or on a common substrate; Assembly of integrated circuit devices
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/498 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
488consisting of soldered or bonded constructions
498Leads on insulating substrates
CPC
G06K 19/07749
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
G06K 19/07752
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
0775arrangements for connecting the integrated circuit to the antenna
07752using an interposer
H01L 21/70
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
H01L 2223/6677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6661for passive devices
6677for antenna, e.g. antenna included within housing of semiconductor device
H01L 2224/0401
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
0401Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
H01L 2224/04105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
04105Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
Applicants
  • ALIEN TECHNOLOGIES, INC. [US]/[US] (AllExceptUS)
  • CRAIG, Gordon, S., W. [US]/[US] (UsOnly)
  • TOOTOONCHI, Aly [US]/[US] (UsOnly)
  • EISENHARDT, Randy [US]/[US] (UsOnly)
  • HERRMANN, Scott [US]/[US] (UsOnly)
  • HADLEY, Mark, A. [US]/[US] (UsOnly)
  • DRZAIC, Paul [US]/[US] (UsOnly)
Inventors
  • CRAIG, Gordon, S., W.
  • TOOTOONCHI, Aly
  • EISENHARDT, Randy
  • HERRMANN, Scott
  • HADLEY, Mark, A.
  • DRZAIC, Paul
Agents
  • SCHELLER, James, C.
Priority Data
11/159,55022.06.2005US
11/268,83707.11.2005US
60/626,24108.11.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD OF MANUFACTURING RFID DEVICES USING FLUIDIC SELF ASSEMBLY AND A LOCAL
(FR) ENSEMBLE COMPRENANT DES DISPOSITIFS FONCTIONNELS ET PROCEDE DE FABRICATION CORRESPONDANT
Abstract
(EN) Methods and apparatuses for an electronic assembly. A material is selectively- printed on a web substrate (2502) at one or more selected areas. The web substrate (2502) includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head (2510, 2512) that dispenses the selected material is used to print. The print head is coupled to a guidance system (2508) capable of registering an alignment feature on the web substrate.
(FR) L'invention concerne des procédés et des appareils destinés à un ensemble électronique. Une matière est sélectivement imprimée sur un substrat en toile au niveau d'une ou plusieurs zones sélectionnées. Le substrat en toile comprend plusieurs composants fonctionnels à circuits intégrés. Un système d'impression local équipé d'une tête d'imprimante qui délivre cette matière sélectionnée est utilisé pour l'impression. La tête d'impression est couplée à un système de guidage permettant d'enregistrer une caractéristique d'alignement sur le substrat en toile.
Related patent documents
Latest bibliographic data on file with the International Bureau