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1. WO2006050691 - LAYING DEVICE, CONTACTING DEVICE, ADVANCING SYSTEM, LAYING AND CONTACTING UNIT, PRODUCTION SYSTEM, METHOD FOR THE PRODUCTION AND A TRANSPONDER UNIT

Publication Number WO/2006/050691
Publication Date 18.05.2006
International Application No. PCT/DE2005/001932
International Filing Date 27.10.2005
IPC
B23K 20/10 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10making use of vibrations, e.g. ultrasonic welding
B23K 20/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
G06K 19/077 2006.1
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
H05K 3/10 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
10in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
CPC
B23K 20/005
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
002specially adapted for particular articles or work
004Wire welding
005Capillary welding
B23K 20/106
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
20Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
10making use of vibrations, e.g. ultrasonic welding
106Features related to sonotrodes
H01L 2224/45147
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45147Copper (Cu) as principal constituent
H01L 2224/78301
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
78Apparatus for connecting with wire connectors
7825Means for applying energy, e.g. heating means
783by means of pressure
78301Capillary
H01L 2224/85205
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
85using a wire connector
852Applying energy for connecting
85201Compression bonding
85205Ultrasonic bonding
H01L 24/45
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
Applicants
  • IMASYS AG [DE]/[DE] (AllExceptUS)
  • LANG, Ulrich [DE]/[DE] (UsOnly)
Inventors
  • LANG, Ulrich
Agents
  • GROSFILLIER, Philippe
Priority Data
10 2004 053 388.102.11.2004DE
10 2005 028 467.120.06.2005DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) VERLEGEVORRICHTUNG, KONTAKTIERVORRICHTUNG, ZUSTELLSYSTEM, VERLEGE- UND KONTAKTIEREINHEIT HERSTELLUNGSANLAGE, VERFAHREN ZUR HERSTELLUNG UND EINE TRANSPONDEREINHEIT
(EN) LAYING DEVICE, CONTACTING DEVICE, ADVANCING SYSTEM, LAYING AND CONTACTING UNIT, PRODUCTION SYSTEM, METHOD FOR THE PRODUCTION AND A TRANSPONDER UNIT
(FR) DISPOSITIF DE POSE, DISPOSITIF D'ETABLISSEMENT DE CONTACT, SYSTEME D'AVANCE, UNITE DE POSE ET D'ETABLISSEMENT DE CONTACT, INSTALLATION DE PRODUCTION, PROCEDE DE PRODUCTION ET ENSEMBLE TRANSPONDEUR
Abstract
(DE) Offenbart ist eine Verlegevorrichtung zum Verlegen von Drahtwicklungen bei Transpondereinheiten mit einer axialen Draht Zuführung zur Verlegevorrichtung, eine Kontaktiervorrichtung zum Kontaktieren der Drähte mit einer selbsttätigen Thermodenklemmanordnung, ein Zustellsystem zum Zustellen von Bearbeitungsvorrichtungen mit einem Piezo-Leg-Motor, eine Herstellungsanlage zur Herstellung von Transpondereinheiten in Konsolenbauweise, ein Verfahren zur Herstellung von Transpondereinheiten mit horizontaler Ultraschalleinleitung und eine Transpondereinheit, bei der die Drahtenden direkt an den Anschlussflächen des Chips angreifen.
(EN) The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.
(FR) L'invention concerne un dispositif de pose pour poser des enroulements de fils au niveau d'ensembles transpondeurs, le fil étant acheminé axialement dans le dispositif de pose, un dispositif d'établissement de contact servant à mettre en contact les fils avec un dispositif de serrage de thermode automatique, un système d'avance pour avancer des dispositifs de traitement au moyen d'un moteur à jambes piézoélectriques, une installation de production pour produire des ensembles transpondeurs selon une construction en console, un procédé de production d'ensembles transpondeurs avec une introduction horizontale des ultrasons, ainsi qu'un ensemble transpondeur dans lequel les extrémités des fils sont directement appliquées sur les plages de connexion des puces.
Latest bibliographic data on file with the International Bureau