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1. WO2006050323 - COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING

Publication Number WO/2006/050323
Publication Date 11.05.2006
International Application No. PCT/US2005/039381
International Filing Date 28.10.2005
Chapter 2 Demand Filed 08.05.2006
IPC
H01L 21/3213 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3205Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layers; After-treatment of these layers
321After-treatment
3213Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
C11D 11/00 2006.1
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
11Special methods for preparing compositions containing mixtures of detergents
C11D 7/32 2006.1
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7Compositions of detergents based essentially on non-surface-active compounds
22Organic compounds
32containing nitrogen
CPC
C11D 11/00
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
11Special methods for preparing compositions containing mixtures of detergents
C11D 11/0047
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
11Special methods for preparing compositions containing mixtures of detergents
0005Special cleaning and washing methods
0011characterised by the objects to be cleaned
0023"Hard" surfaces
0047Electronic devices, e.g. PCBs, semiconductors
C11D 7/32
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
7Compositions of detergents based essentially on non-surface-active compounds
22Organic compounds
32containing nitrogen
C11D 7/3209
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
7Compositions of detergents based essentially on non-surface-active compounds
22Organic compounds
32containing nitrogen
3209Amines or imines with one to four nitrogen atoms; Quaternized amines
C11D 7/3218
CCHEMISTRY; METALLURGY
11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
DDETERGENT COMPOSITIONS
7Compositions of detergents based essentially on non-surface-active compounds
22Organic compounds
32containing nitrogen
3218Alkanolamines; Alkanolimines
G03F 7/425
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26Processing photosensitive materials; Apparatus therefor
42Stripping or agents therefor
422using liquids only
425containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen
Applicants
  • EKC TECHNOLOGY, INC. [US]/[US] (AllExceptUS)
  • LEE, Wai, Mun [US]/[US] (UsOnly)
Inventors
  • LEE, Wai, Mun
Agents
  • HAYDEN, Christopher, G.
Priority Data
60/623,19029.10.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING
(FR) COMPOSITIONS ET PROCEDES DE DECAPAGE ET D'ELIMINATION DE RESIDUS DES ENCAPSULATIONS AU NIVEAU DE LA TRANCHE
Abstract
(EN) Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrates with mixtures containing an effective amount of organic ammonium compound(s); from about 2 to about 20 weight percent of oxammonium compound(s); optionally organic solvent(s); and water.
(FR) L'invention concerne des compositions et des procédés améliorés d'élimination de photorésines, de polymères, de résidus de gravure, et de résidus de corrosion par l'oxygène des interconnexions, des encapsulations au niveau de la tranche et des substrats à cartes de circuits imprimés. Un procédé consiste à mettre en contact ces substrats avec des mélanges qui renferment une quantité efficace d'un ou de plusieurs composés d'ammonium organique; entre environ 2 et environ 20 % en poids de composés d'oxammonium; éventuellement un ou plusieurs solvants organiques; et enfin, de l'eau.
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