WO2006050323 COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING

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Publication Number WO/2006/050323

Publication Date 11.05.2006

International Application No. PCT/US2005/039381

International Filing Date 28.10.2005

Chapter 2 Demand Filed 08.05.2006

IPC

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CPC

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Applicants

EKC TECHNOLOGY, INC. [US]/[US] (AllExceptUS)
LEE, Wai, Mun [US]/[US] (UsOnly)

Inventors

LEE, Wai, Mun

Agents

HAYDEN, Christopher, G.

Priority Data

60/623,190

29.10.2004

Publication Language English (en)

Filing Language English (EN)

Designated States

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Title

(EN) COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING

(FR) COMPOSITIONS ET PROCEDES DE DECAPAGE ET D'ELIMINATION DE RESIDUS DES ENCAPSULATIONS AU NIVEAU DE LA TRANCHE

Abstract

(EN) Improved compositions and processes for removing photoresists, polymers, post etch residues, and post oxygen ashing residues from interconnect, wafer level packaging, and printed circuit board substrates are disclosed. One process comprises contacting such substrates with mixtures containing an effective amount of organic ammonium compound(s); from about 2 to about 20 weight percent of oxammonium compound(s); optionally organic solvent(s); and water.

(FR) L'invention concerne des compositions et des procédés améliorés d'élimination de photorésines, de polymères, de résidus de gravure, et de résidus de corrosion par l'oxygène des interconnexions, des encapsulations au niveau de la tranche et des substrats à cartes de circuits imprimés. Un procédé consiste à mettre en contact ces substrats avec des mélanges qui renferment une quantité efficace d'un ou de plusieurs composés d'ammonium organique; entre environ 2 et environ 20 % en poids de composés d'oxammonium; éventuellement un ou plusieurs solvants organiques; et enfin, de l'eau.

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31	to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3205	Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layers; After-treatment of these layers
321	After-treatment
3213	Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
11	Special methods for preparing compositions containing mixtures of detergents

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
7	Compositions of detergents based essentially on non-surface-active compounds
22	Organic compounds
32	containing nitrogen

H	ELECTRICITY
01	BASIC ELECTRIC ELEMENTS
L	SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21	Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02	Manufacture or treatment of semiconductor devices or of parts thereof
04	the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18	the devices having semiconductor bodies comprising elements of group IV of the Periodic System or A_IIIB_V compounds with or without impurities, e.g. doping materials
30	Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
31	to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After-treatment of these layers; Selection of materials for these layers
3205	Deposition of non-insulating-, e.g. conductive- or resistive-, layers, on insulating layers; After-treatment of these layers
321	After-treatment
3213	Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
11	Special methods for preparing compositions containing mixtures of detergents

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1. WO2006050323 - COMPOSITIONS AND PROCESSES FOR PHOTORESIST STRIPPING AND RESIDUE REMOVAL IN WAFER LEVEL PACKAGING

C	CHEMISTRY; METALLURGY
11	ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
D	DETERGENT COMPOSITIONS
11	Special methods for preparing compositions containing mixtures of detergents

G	PHYSICS
03	PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
F	PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7	Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
26	Processing photosensitive materials; Apparatus therefor
42	Stripping or agents therefor
422	using liquids only
425	containing mineral alkaline compounds; containing organic basic compounds, e.g. quaternary ammonium compounds; containing heterocyclic basic compounds containing nitrogen

H	ELECTRICITY
05	ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
K	PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203	Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
12	Using specific substances
122	Organic non-polymeric compounds, e.g. oil, wax, thiol