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1. WO2006048185 - METHOD AND DEVICE FOR TREATING SUBSTRATES AND CORRESPONDING NOZZLE UNIT

Publication Number WO/2006/048185
Publication Date 11.05.2006
International Application No. PCT/EP2005/011533
International Filing Date 28.10.2005
Chapter 2 Demand Filed 18.08.2006
IPC
H01L 21/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
CPC
H01L 21/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
18the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
302to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
H01L 21/6704
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
Applicants
  • HAMATECH APE GMBH & CO. KG [DE]/[DE] (AllExceptUS)
  • BRANZ, Karsten [DE]/[DE] (UsOnly)
  • DRESS, Peter [DE]/[DE] (UsOnly)
  • SOWA, Michael [DE]/[DE] (UsOnly)
  • GAIRING, Thomas [DE]/[DE] (UsOnly)
Inventors
  • BRANZ, Karsten
  • DRESS, Peter
  • SOWA, Michael
  • GAIRING, Thomas
Priority Data
10 2004 053 337.704.11.2004DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) VERFAHREN UND VORRICHTUNG ZUM BEHANDELN VON SUBSTRATEN UND DÜSENEINHEIT HIERFÜR
(EN) METHOD AND DEVICE FOR TREATING SUBSTRATES AND CORRESPONDING NOZZLE UNIT
(FR) PROCEDE ET DISPOSITIF POUR TRAITER DES SUBSTRATS ET UNITE A BUSES UTILISEE A CET EFFET
Abstract
(DE) Die vorliegende Erfindung betrifft ein Verfahren zum Behandeln von Substraten mit folgenden Verfahrensschritten: Ausbilden eines Flüssigkeitsfilms auf einem lokalen Oberflächenbereich des zu behandelnden Substrats durch eine Düseneinheit mit wenigstens einer langgestreckten Düsenanordnung und einer benachbart hierzu angeordneten Ultraschall- bzw. Megaschallwandleranordnung; Inkontaktbringen wenigstens eines Teils der Ultraschallwandleranordnung mit dem Flüssigkeitsfilms; und Einbringen von Ultraschall in den ausgebildeten Flüssigkeitsfilm mit der Ultraschall-Wandleranordnung.
(EN) The invention relates to a method for treating substrates, which method comprises the following steps: producing a liquid film on a local surface area of the substrate to be treated using a nozzle unit which comprises at least one elongate nozzle arrangement and also using an ultrasound or megasound transducer arrangement arranged next to it; contacting at least a part of the ultrasound transducer arrangement with the liquid film; and introducing ultrasound into the liquid film produced using the ultrasound transducer arrangement.
(FR) L'invention concerne un procédé pour traiter des substrats comprenant les étapes suivantes : formation d'une pellicule liquide sur une surface locale du substrat à traiter par une unité à buses comprenant au moins un dispositif à buses allongé et un dispositif transformateur d'ultrasons ou de mégasons adjacent à celui-ci ; mise en contact d'au moins une partie du dispositif transformateur d'ultrasons avec la pellicule liquide ; et introduction d'ultrasons dans la pellicule liquide, ainsi formée, au moyen du dispositif transformateur d'ultrasons.
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