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1. WO2006047240 - THERMOELECTRIC COOLING AND/OR MODERATION OF TRANSIENT THERMAL LOAD USING PHASE CHANGE MATERIAL

Publication Number WO/2006/047240
Publication Date 04.05.2006
International Application No. PCT/US2005/037801
International Filing Date 21.10.2005
IPC
F25B 21/02 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION OR SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS, OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
21Machines, plant, or systems, using electric or magnetic effects
02using Peltier effect; using Nernst-Ettinghausen effect
CPC
F25B 21/02
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
21Machines, plant, or systems, using electric or magnetic effects
02using Peltier effect; using Nernst-Ettinghausen effect
F25B 2321/021
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
2321Details of machines, plants, or systems, using electric or magnetic effects
02using Peltier effects; using Nernst-Ettinghausen effects
021Control thereof
F25B 2321/025
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT-PUMP SYSTEMS
2321Details of machines, plants, or systems, using electric or magnetic effects
02using Peltier effects; using Nernst-Ettinghausen effects
025Removal of heat
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 31/024
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
31Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
02Details
024Arrangements for cooling, heating, ventilating or temperature compensation
H01L 33/645
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
48characterised by the semiconductor body packages
64Heat extraction or cooling elements
645the elements being electrically controlled, e.g. Peltier elements
Applicants
  • NANOCOOLERS, INC. [US]/[US] (AllExceptUS)
  • GHOSHAL, Uttam [US]/[US] (UsOnly)
Inventors
  • GHOSHAL, Uttam
Agents
  • ZAGORIN OBRIEN GRAHAM LLP; GRAHAM, Andrew C. et al.
Priority Data
11/123,88206.05.2005US
60/621,38222.10.2004US
60/673,95422.04.2005US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) THERMOELECTRIC COOLING AND/OR MODERATION OF TRANSIENT THERMAL LOAD USING PHASE CHANGE MATERIAL
(FR) REFROIDISSEMENT THERMOELECTRIQUE ET/OU MODERATION DE LA CHARGE THERMIQUE TRANSITOIRE UTILISANT UNE MATIERE A CHANGEMENT DE PHASE
Abstract
(EN) Techniques described and illustrated herein can permit high luminous flux and/or longer lifetimes for a class of photoemissive device configurations and/or uses that generate intense highly localized, but transient heat flux. For example, certain LED applications, e.g., for flash illumination, certain solid state laser configurations and other similar configurations and uses may benefit from the developed techniques. It has been discovered that by locating an amount of appropriate phase change material in close thermal proximity to such a photoemissive device, substantial generated heat fluxes may be 'absorbed' into a phase transition of the phase change material. In some configurations, a thermoelectric is employed in conjunction with the phase change material. Similar configurations may be employed for photosensitive devices. The thermoelectric may be transiently operated in substantial synchrony with operation of the photoemissive or photosensitive device to provide extremely high density spot cooling when and where desired.
(FR) L'invention concerne des techniques permettant de former des flux lumineux intenses et/ou d'allonger la durée de vie d'une classe de dispositifs photoémissifs et/ou de mettre en oeuvre des applications qui produisent un flux thermique intense très localisé mais transitoire. Par exemple, certaines applications de DEL, p. ex. pour l'éclairage par flash, certaines configurations de laser à solide et d'autres configurations et applications similaires pouvant bénéficier des techniques mises au point. Il a été découvert que la mise en place d'une quantité de matière à changement de phase appropriée à proximité thermique étroite d'un tel dispositif photoémissif permet d''absorber' sensiblement, grâce à une transition de phase de la matière, les flux thermiques produits. Dans certaines configurations, un élément thermoélectrique est employé conjointement avec la matière à changement de phase. Des configurations similaires peuvent être employées pour des dispositifs photosensibles. L'élément thermoélectrique fonctionne de manière transitoire et sensiblement synchrone avec le dispositif photoémissif ou photosensible pour mettre en oeuvre un refroidissement ponctuel à densité extrêmement élevée au moment et à l'endroit voulus.
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