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1. WO2006046998 - VAPOR DEPOSITION SOURCE WITH PLUAL APERTURES

Publication Number WO/2006/046998
Publication Date 04.05.2006
International Application No. PCT/US2005/029040
International Filing Date 15.08.2005
IPC
C23C 14/24 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
CPC
C23C 14/243
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
243Crucibles for source material
H01L 51/001
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
0002Deposition of organic semiconductor materials on a substrate
0008using physical deposition, e.g. sublimation, sputtering
001Vacuum deposition
H01L 51/0081
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
0032Selection of organic semiconducting materials, e.g. organic light sensitive or organic light emitting materials
0077Coordination compounds, e.g. porphyrin
0079Metal complexes comprising a IIIB-metal (B, Al, Ga, In or TI), e.g. Tris (8-hydroxyquinoline) gallium (Gaq3)
0081comprising aluminium, e.g. Alq3
H01L 51/56
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
51Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
50specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED]
56Processes or apparatus specially adapted for the manufacture or treatment of such devices or of parts thereof
Applicants
  • EASTMAN KODAK COMPANY [US]/[US] (AllExceptUS)
  • FREEMAN, Dennis, Ray [US]/[US] (UsOnly)
  • REDDEN, Neil, Peter [US]/[US] (UsOnly)
  • VAN, SLYKE, Steven, Arland [US]/[US] (UsOnly)
Inventors
  • FREEMAN, Dennis, Ray
  • REDDEN, Neil, Peter
  • VAN, SLYKE, Steven, Arland
Common Representative
  • EASTMAN KODAK COMPANY
Priority Data
10/971,69825.10.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) VAPOR DEPOSITION SOURCE WITH PLUAL APERTURES
(FR) SOURCE DE DEPOT PAR EVAPORATION SOUS VIDE POURVUE DE PLUSIEURS OUVERTURES
Abstract
(EN) A container (30) for vaporizing a solid material includes a housing having side walls, a bottom wall, and a cover (40) enclosing an interior volume. The cover includes at least one aperture to permit egress of vapor efflux from the housing. A heater heats at least a portion of the housing to vaporize the solid material. A baffle (50) disposed between the cover and the solid material prevents a direct line of sight between the solid material and the aperture(s) and is spaced from the cover to control the flow of vaporized material into a region between the baffle and the cover to promote uniformity of vapor efflux from the aperture(s). The ratio of the interior volume to a volume of the region between the baffle and the cover is at least approximately 20:1. The solid material can be an organic material used to form a layer of an organic light-emitting device.
(FR) Cette invention concerne un contenant (30) conçu pour vaporiser un matériau solide, lequel contenant comprend un boîtier présentant des parois latérales, une paroi de fond, et un couvercle (40) renfermant un volume intérieur. Le couvercle comprend au moins une ouverture pour permettre l'évacuation des échappements de vapeur du boîtier. Un dispositif de chauffage chauffe au moins une partie du boîtier de manière à vaporiser le matériau solide. Un déflecteur (50) disposé entre le couvercle et le matériau solide empêche une visibilité directe entre le matériau solide et la ou les ouvertures, ce déflecteur est placé à distance du couvercle de manière à réguler l'écoulement du matériau vaporisé dans une zone entre le déflecteur et le couvercle afin de favoriser l'uniformité de l'échappement de la vapeur depuis l'ouverture ou les ouvertures. Le rapport du volume intérieur sur un volume de la zone entre le déflecteur et le couvercle est d'environ 20:1. Le matériau solide peut être un matériau organique utilisé pour former une couche d'un dispositif électroluminescent organique.
Latest bibliographic data on file with the International Bureau