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1. WO2006046713 - ELECTRONIC COMPONENT MODULE AND WIRELESS COMMUNICATION EQUIPMENT

Publication Number WO/2006/046713
Publication Date 04.05.2006
International Application No. PCT/JP2005/019927
International Filing Date 28.10.2005
IPC
H01L 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 9/00 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
9Screening of apparatus or components against electric or magnetic fields
CPC
H01L 2223/6677
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6661for passive devices
6677for antenna, e.g. antenna included within housing of semiconductor device
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/73253
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73253Bump and layer connectors
H01L 2224/97
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
93Batch processes
95at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
97the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
H01L 23/3121
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
3121a substrate forming part of the encapsulation
H01L 23/552
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
552Protection against radiation, e.g. light ; or electromagnetic waves
Applicants
  • 京セラ株式会社 KYOCERA CORPORATION [JP]/[JP] (AllExceptUS)
  • 京セラキンセキ株式会社 KYOCERA KINSEKI CORPORATION [JP]/[JP] (AllExceptUS)
  • 畠中 英文 HATANAKA, Hidefumi [JP]/[JP] (UsOnly)
  • 谷口 智彦 TANIGUCHI, Tomohiko [JP]/[JP] (UsOnly)
Inventors
  • 畠中 英文 HATANAKA, Hidefumi
  • 谷口 智彦 TANIGUCHI, Tomohiko
Agents
  • 稲岡 耕作 INAOKA, Kosaku
Priority Data
2004-31376428.10.2004JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC COMPONENT MODULE AND WIRELESS COMMUNICATION EQUIPMENT
(FR) MODULE DE COMPOSANT ELECTRONIQUE ET MATERIEL DE COMMUNICATION SANS FIL
(JA) 電子部品モジュール及び無線通信機器
Abstract
(EN) An IC element (2) having an oscillating circuit and an amplifying circuit is mounted on a wiring board (1). The IC element (2) is covered with a sealing resin layer (4) having a window part (4a) on the upper plane of the IC element (2), and then a shield layer (5) is deposited on the sealing resin layer (4) and the window part (4a). Penetration of electromagnetic waves into the IC element (2) can be reduced and a transmission signal from the IC element (2) can be stabilized by the simple structure.
(FR) La présente invention concerne un élément de circuit intégré (2) ayant un circuit d’oscillation et un circuit d’amplification, et étant monté sur une carte de câblage (1). L’élément de circuit intégré (2) est recouvert par une couche de résine d’étanchéité (4) ayant une partie de fenêtre (4a) sur le plan supérieur de l’élément de circuit intégré (2), puis une couche de protection (5) est déposée sur la couche de résine d’étanchéité (4) et la partie de fenêtre (4a). La pénétration d’ondes électromagnétiques dans l’élément de circuit intégré (2) peut être réduite et un signal de transmission provenant de l’élément de circuit intégré (2) peut être stabilisé grâce à cette structure simple.
(JA)  配線基板1上に、発振回路及び増幅回路を有するIC素子2を搭載するとともに、IC素子2を、IC素子2上面に窓部4aを有した封止樹脂層4により被覆し、その上からシールド層5を封止樹脂層4及び窓部4aに被着させる。簡単な構造で、IC素子2への電磁波の侵入を低減し、IC素子2からの送信信号を安定させることが可能になる。
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