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1. WO2006046649 - SUBSTRATE TREATING DEVICE AND SUBSTRATE ROTATING DEVICE

Publication Number WO/2006/046649
Publication Date 04.05.2006
International Application No. PCT/JP2005/019795
International Filing Date 27.10.2005
Chapter 2 Demand Filed 28.08.2006
IPC
H01L 21/683 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components
683for supporting or gripping
CPC
H01L 21/67109
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67098Apparatus for thermal treatment
67109mainly by convection
H01L 21/68
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
68for positioning, orientation or alignment
H01L 21/68792
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
683for supporting or gripping
687using mechanical means, e.g. chucks, clamps or pinches
68714the wafers being placed on a susceptor, stage or support
68792characterised by the construction of the shaft
Applicants
  • 東京エレクトロン株式会社 TOKYO ELECTRON LIMITED [JP]/[JP] (AllExceptUS)
  • 田中 澄 TANAKA, Sumi [JP]/[JP] (UsOnly)
  • 鈴木 公貴 SUZUKI, Kouki [JP]/[JP] (UsOnly)
Inventors
  • 田中 澄 TANAKA, Sumi
  • 鈴木 公貴 SUZUKI, Kouki
Agents
  • 吉武 賢次 YOSHITAKE, Kenji
Priority Data
2004-31391928.10.2004JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) SUBSTRATE TREATING DEVICE AND SUBSTRATE ROTATING DEVICE
(FR) DISPOSITIF DE TRAITEMENT DE SUBSTRAT ET DISPOSITIF DE ROTATION DE SUBSTRAT
(JA) 基板処理装置および基板回転装置
Abstract
(EN) A substrate treating device and a substrate rotating device. The substrate rotating device comprises a rotatably driven body (11) connected to substrate supporting bodies (12, 13, 14) and a rotatingly driving body (10) rotatingly driving the rotatingly driven body (11) by rotating in the state of coming into contact with the rotatingly driven body (11). The rotatingly driven body (11) and the rotatingly driving body (10) are formed of a ceramics material.
(FR) Il est décrit un dispositif de traitement de substrat et un dispositif de rotation de substrat. Le dispositif de rotation de substrat comprend un corps entraîné en rotation (11) raccordé à des corps de support de substrat (12, 13, 14) et un corps entraîné en rotation (10) entraînant en rotation le corps entraîné en rotation (11) par rotation lors de l'entrée en contact avec le corps entraîné en rotation (11). Le corps entraîné en rotation (11) et le corps entraîné en rotation (10) sont formés d'un matériau céramique.
(JA) not available
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