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1. WO2006046236 - METHOD AND APPARATUS FOR RESIDUE DETECTION ON A POLISHED WAFER

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Publication Number WO/2006/046236
Publication Date 04.05.2006
International Application No. PCT/IL2005/001110
International Filing Date 26.10.2005
IPC
G01N 21/95 2006.1
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws, defects or contamination
95characterised by the material or shape of the object to be examined
CPC
G01N 21/93
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
93Detection standards; Calibrating ; baseline adjustment, drift correction
G01N 21/94
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
94Investigating contamination, e.g. dust
G01N 21/9501
GPHYSICS
01MEASURING; TESTING
NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
21Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
84Systems specially adapted for particular applications
88Investigating the presence of flaws or contamination
95characterised by the material or shape of the object to be examined
9501Semiconductor wafers
H01L 21/67242
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67242Apparatus for monitoring, sorting or marking
Applicants
  • MAY HIGH-TECH SOLUTIONS, LTD. [IL]/[IL] (AllExceptUS)
  • BARKOL, Arie [IL]/[IL] (UsOnly)
  • GUTMAN, Moshe [IL]/[IL] (UsOnly)
  • FIREAIZEN, Haim, Moshe [IL]/[IL] (UsOnly)
  • PEISACH, Aviva [IL]/[IL] (UsOnly)
  • ROSENBERG, Moshe [IL]/[IL] (UsOnly)
Inventors
  • BARKOL, Arie
  • GUTMAN, Moshe
  • FIREAIZEN, Haim, Moshe
  • PEISACH, Aviva
  • ROSENBERG, Moshe
Agents
  • WOLFF, BREGMAN AND GOLLER
Priority Data
60/622,44326.10.2004US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) METHOD AND APPARATUS FOR RESIDUE DETECTION ON A POLISHED WAFER
(FR) PROCEDE ET APPAREIL DE DETECTION DE RESIDUS SUR UNE PLAQUETTE POLIE
front page image
Abstract
(EN) There is provided an automatic optical inspection tool of an apparatus for residue detection on polished wafers, including an inspection tool, an illumination source, capable of instantaneous entire wafer surface illumination, colour digital camera, encompassing the entire wafers surface without eclipse, in a duple of consecutive, properly delayed imaging shots and provided appropriate image resolution for tiny residue detection, computation means, implementing image processing and manipulation algorithms to enable reside detection and characterization, logic and command operations execution and camera control, the computation means accumulating an on-line created wafer images and wafer residue defects data base, the computation means providing for inspection tool worthiness monitoring, wafer handling and transportation means. A method of automatic optical self-contained for pattern wafers' polishing residue detection is also provided.
(FR) L'invention concerne un outil d'inspection optique automatique d'un appareil de détection de résidus sur des plaquettes polies, comprenant un outil d'inspection, une source d'éclairage, pouvant éclairer instantanément la surface de plaquettes entière, une caméra numérique couleur, couvrant la surface de plaquettes entière sans éclipse, en deux prises de vue retardées de manière appropriée, consécutives, et assurant une résolution d'image appropriée pour la détection de résidus minuscules, un moyen de calcul, mettant en oeuvre des algorithmes de traitement et de manipulation d'images destinés à permettre la détection et la caractérisation de résidus, l'exécution d'opérations logiques et de commande et la commande de la caméra, le moyen de calcul accumulant une base de données d'images de plaquette et de défauts de type résidus de plaquette créée en ligne, le moyen de calcul permettant la surveillance de la capacité de l'outil d'inspection, un moyen de transport et de manipulation de plaquette. L'invention concerne également un procédé d'inspection autonome optique, automatique, pour la détection de résidus de polissage de plaquettes à motifs.
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