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1. WO2006044001 - METHOD FOR MAGNETRON SPUTTER DEPOSITION

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Publication Number WO/2006/044001
Publication Date 27.04.2006
International Application No. PCT/US2005/024110
International Filing Date 07.07.2005
IPC
C23C 14/34 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
CPC
C23C 14/046
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
04Coating on selected surface areas, e.g. using masks
046Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
C23C 14/35
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
34Sputtering
35by application of a magnetic field, e.g. magnetron sputtering
H01J 37/3405
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
37Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
32Gas-filled discharge tubes, ; e.g. for surface treatment of objects such as coating, plating, etching, sterilising or bringing about chemical reactions
34operating with cathodic sputtering
3402using supplementary magnetic fields
3405Magnetron sputtering
Applicants
  • SOUTHWEST RESEARCH INSTITUTE [US]/[US] (AllExceptUS)
Inventors
  • WEI, Ronghua
Agents
  • MORRIS, Paula, D.
Priority Data
10/962,77212.10.2004US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) METHOD FOR MAGNETRON SPUTTER DEPOSITION
(FR) PROCEDE DE PULVERISATION CATHODIQUE DE MAGNETRON
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Abstract
(EN)
A method for depositing a coating on an interior surface of a hollowed workpiece. The method comprises providing the hollowed workpiece (206) in a vacuum chamber (210), the hollowed workpiece (206) comprising an interior surface substantially defining a bore having a longitudinal; positioning a magnetron (216) within the bore along substantially the length of the longitudinal axis and substantially radially equidistant from the interior surface, the magnetron comprising an external sputter target material; and, generating a circumferential magnetic field about the sputter target material for a time and under sputter deposition conditions producing an interior surface comprising a substantially uniform coating comprising the sputter target material.
(FR)
L'invention concerne un procédé permettant de déposer un revêtement sur une surface interne d'une pièce à usiner creuse. Ledit procédé consiste à fournir ladite pièce à usiner creuse (206) dans une chambre sous vide (210), cette pièce à usiner creuse (206) comportant une surface interne qui forme pratiquement un trou à axe longitudinal. Puis, ledit procédé consiste à positionner un magnétron (216) au sein du trou sensiblement sur la longueur dudit axe et pratiquement équidistant radialement de la surface interne, ledit magnétron renfermant une matière cible de pulvérisation externe. Enfin, ce procédé consiste à engendrer un champ magnétique circonférentiel autour de la matière cible de pulvérisation pour une certaine période de temps et dans des conditions de dépôt par pulvérisation qui produisent une surface interne à revêtement sensiblement uniforme contenant la matière cible de pulvérisation.
Also published as
US20060076231
Latest bibliographic data on file with the International Bureau
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